Re: DC-WG: 6/9 meeting minutes
Mark Hahn (mhahn@cadence.com)
Tue, 23 Jun 1998 07:28:42 -0700
On Jun 22,  4:38pm, Steve Grout wrote:
> Subject: DC-WG: 6/9 meeting minutes
>
> Mark -
>
>  >  5.   Steve       6/22    First draft of taxonomy for parasitics
>  >                           boundary conditions
>  > ...
>
> Mark - please give me a sanity check on this. I am interpreting the
> above, per our brief conversation at SLDL, that my scope initially
> includes all definitions about parasitics with respect to timing,
> e.g.,
>
>    ...
>  - pin capacitance to substrate
>  - pin drive
>  - pin loading
>  - netsegment lumped capacitance to substrate
>  - netsegment lumped capacitance to some other netsegment
>  - netsegment per unit capacitance to substrate
>  - netsegment lumped serial resistance
>  - netsegment per-unit serial resistance
>  - netsegment lumped self-inductance
>  - netsegment per-unit self-inductance
>  - netsegment lumped mutual-inductance to some other netsegment
>  - netsegment per-unit self-inductance resistance to some other netsegment
>  - power supply drive effective impedance
>  - ground/substrate effective impedance
>  - substrate thermal impedance
>  - substrate per-unit-area thermal impedance
>    ...
I think that most of these are technology parameters which would
be specified by the foundry as part of the library, rather than
constraints/operating environment conditions which are specified
by the user.  I was expecting the parasitics boundary conditions
to include
  - external load (lumped capacitance)
    - could be separated into pin capacitance and wire capacitance
  - external fanout (# pins, wire load model name)
  - external detailed parastics (SPEF or DSPF file)
    - this is not widely supported today, but I believe it will
      become essential for hierarchical physical design
  - driver cell type
  - drive strength
  - input slew
> with the definitions applicable to today's ASIC practices as well
> as the coming VDSM (250nm and below down to 100nm) RLCM distributed
> parasitics etc.
We should definitely address things down to 100nm, or the standard will
be obsolete before it's released.
Mark
-- 
Mark Hahn                                          phone: (408) 428-5399
Architect, Deep Submicron Business Unit            fax:   (408) 428-5959
Cadence Design Systems                             email: mhahn@cadence.com