DF000001 N. Young QML-38510-6 Cus Hybd Mkct >QUALIFICATIONS VALIDATED> CUSTOM HYBRID MICROCIRCUITS > ANNUALLY > QML-38510-6 14 June 1989 SUPERSEDING QML-38510-5 10 November 1988 QUALIFIED MANUFACTURERS LIST OF >FSC 5962> CUSTOM HYBRID PRODUCTS QUALIFIED UNDER MILITARY SPECIFICATION MIL-M-38510, APPENDIX G CUSTOM HYBRID MICROCIRCUITS GENERAL REQUIREMENTS FOR This list has been prepared for use by or for the Government in the acquisition of products covered by Specification MIL-M-38510, Appendix G. Listing of a product is not intended to and does not connote endorsement of the product by the Department of Defense. This list is subject to change without notice; revision or amendment of this list will be issued as necessary. The listing of a product does not release the supplier from compliance with the individual item specification requirements. THE ACTIVITY RESPONSIBLE FOR THIS QML IS THE UNITED STATES AIR FORCE, CODE 17. The activity designated as agent for all contacts relative to this QML is the Defense Electronics Supply Center (DESC-EQ), Dayton, OH 45444-5000. If a manufacturer desires to have test data considered for qualification, he must perform all required qualification tests; the qualification sample must be produced with DESC certified materials and manufacturing construction techniques; and he must comply with the requirements specified in Appendix G, MIL-M-38510, prior to the start of any testing. The listing of custom hybrid microcircuit materials and manufacturing construction techniques in the Qualified Manufacturers List 38510 Supplement applies only to products produced in the plant(s) specified on the QML. Therefore, only those products that have been manufactured, assembled, and tested within the United States and its territories, except as provided by international agreement establishing reciprocal and equivalent quality systems and procedures, can be supplied as qualified custom hybrid QML devices. Custom hybrid microcircuits manufactured, assembled, and tested in accordance with MIL-M-38510, Appendix G, shall not bear the "JAN" certification mark or the "J" abbreviation. However, products manufactured, assembled, and tested for Class S or Class B, with all the provisions of MIL-M-38510, Appendix G; MIL-STD-883, Test Method 5008; MIL-STD-1772; and with DESC certified materials and manufacturing construction techniques can be represented as being compliant to appropriate product assurance levels as listed herein. The information contained in this QML reflects the actual material and manufacturing construction techniques of the particular test sample(s). Any product represented as being compliant shall be comprised combinatorially of a manufacturer's listing from the materials and manufacturing construction techniques code table, as listed in MIL-STD-1772 and herein, as is necessary to meet the requirements of the user. The user shall be responsible for determining if the QML listing is adequate to demonstrate capability for the intended application. Supplemental testing and listing can be accomplished by application and approval of DESC-EQ. Testing is not limited to those materials and manufacturing construction techniques currently listed in Attachment I, Materials and Manufacturing Construction Techniques Code Table. However, testing must be completed and approved before the product can be shipped or used in the intended application. To obtain MIL-M-38510, Appendix G, qualified custom hybrid microcircuits, the procurement document must specify that the product be manufactured to MIL-M-38510, Appendix G; and be comprised of materials and manufacturing construction techniques listed herein. Ordering data is contained in paragraph 6.1 of MIL-M-38510, except item l shall not require the "JAN" designator. All procurement documents shall meet the requirements of MIL-M-38510, Appendix F. 1 of 12 CUSTOM HYBRID MICROCIRCUITS AMSC N/A QML-38510-6 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. R All products using the materials and manufacturing construction techniques listed herein have been qualified under the requirements for the production of custom hybrid products as specified in the latest effective issue of MIL-M-38510, Appendix G. TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Advanced Analog CEXA/52467 1772-331-89 B A, G, 11(2), 30, 43, 62, 71 A Division of Intech 2270 Martin Avenue Santa Clara, CA 95050-2781 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(2.88), U, Z, 80, 92, 102 A(570), P, Y, 110, 120, A, J(1), Y, 160, 170, A, K(3.69), W, X, Z, 140, 150 181, 200, 230 204, 210, 220 B(180), P, Y, 110, 120, 140, 155 A(360), P, Y, 110, 120, 140, 152 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Analog Devices, Inc. CEUJ/51640 1772-884-87 B A, G, 11(2), 30 Micro Electronics Div. 829 Woburn Street Wilmington, MA 01887 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(3.67), V, Z, 80, 92, 102 A(582), P, Y, 110, 120, A, J(1.25), Y, 160, A, K(4.35), Z, 204, 140, 152 170, 181, 200, 230 210 B(260), P, Z, 110, 120, A, J(1.25), Z, 161, 140, 155 170, 181, 200, 230 E(696), P, Z, 110, 120, C, J(1.25), Z, 161, 140, 153 171, 181, 200, 230 E(528), Q, Y, 110, 120, 140, 153 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Analog Devices, Inc. CETW/34031 1772-837-86 B A, G, 11(1), 30, 43, 62, 71 Computer Labs Division 7910 Triad Center Drive Greensboro, NC 27409 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(1.73), V, Z, 80, 92, 104 A(100), P, Y, 110, 120, A, J(1), Y, 160, 170, D, L(1.91), Z, 202, 140, 150 181, 200, 230 210, 220 A(112), P, Y, 110, 120, C, J(1), Y, 160, 171, 140, 152 181, 200, 230 2 CUSTOM HYBRID MICROCIRCUITS QML-38510-6. TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Beckman Industrial Corp. CEXB/73138 1772-203-88 B A, G, 11(1), 30, 43, 62, 71 Electronic Technologies Div. 414 Palm Street Fullerton, CA 92635 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(2.97), V, Y, 80, 92, 104 A(80), N(AuSi), Z, 110, A, J(1), Z, 160, 170, A, I(3.58), 202, 212 120, 140, 152 180, 181, 200, 230 A(292), P, Z, 110, 120, 140, 152 F(160), P, Z, 110, 120, 140, 150 B(180), P, Z, 110, 120, 140, 155 E(376), P, Z, 110, 120, 140, 153 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Boeing Electronics Co. CEUW/81205 1772-740-87 B A, G, 11(2), 30, 43, 62, 71 20403 68th Avenue, S. Kent, WA 98124 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(4.2), V, Y, 80, 92, 100 A(112), N(AuSi), Y, 110, A, J(1), Y, 160, 161, A, J(5.04), X, Y, Z, 120, 140, 150, 152 170, 181, 200, 230 203, 210 A(272), P, Y, 110, 120, 140, 150, 152 B(540), P, Y, 110, 120, 140, 155 B(270), Q, 110, 120, 140, 155 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION CTS Microelectronics CEUR/23223 1772-1576-86 B B, G, 13(1), 40, 62, 71 1201 Cumberland Avenue 1772-656-87 A, G, 11(1), 43, 60, 71 West Lafayette, IN 47906 B, G, 13(1), 40, 63, 71 A, G, 11(3), 30, 43, 62 A, G, 11(1), 16(1), 30, 43, 62, 71 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(0.52), U, Z, 82, 92, 104 A(80), N(AuSi), Y, 112, A, J(1.0/1.2), Y, 161, D, L(0.90), 202, 210 A(0.64, S(Au/Ge), Z, 80, 120, 140, 150 170, 181, 200, 230 D, L(2.75), 207, 210 90, 104 A(470), N(AuSi), 110, A, J(1.2/2.0), Y, 161, A, B(AuSn-80/20), A(0.94), T(Sn-96), Z, 80, 120, 140, 150 170, 181, 200, 230 K(1.39), 204, 210 92, 104 A(460), P, Y, 111, 112, A, J(0.7/1.0), Y, 161 A, I(4.40), W, Z, 202, A(0.70), S(Au/Sn), Z, 80, 120, 140, 150, 152 170, 181, 200, 230 210 94, 102, 104 B(360), P, Y, 111, 112, D, L(1.90), 202, 212, A(4.20), V, Z, 80, 92, 104 120, 140, 155 220 A(1.32), V, Z, 83, 92, 104 B(360), N(AuGe), Y, 110, B(AuSn-80/20), K(1.39), 120, 140, 156 204, 210 E(240), Q, Y, 110, 120, 140, 153 3 CUSTOM HYBRID MICROCIRCUITS QML-38510-6 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS COD NUMBER LEVEL SUBSTRATE FABRICATION Elantec, Inc. CEWO/64762 1772-030-88 B A, G, 11(1), 30, 43, 62, 71 1996 Tarob Court Milpitas, CA 95035 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(1.32), T(AuSn), Z, 80, A(208), N(AuSi), Z, 110, A, J(1.0), Z, 160, A, L(1.88), 202, 210, 90, 104 120, 140, 150 170, 181, 200, 230 220 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS COD NUMBER LEVEL SUBSTRATE FABRICATION Garrett Canada CESO/07217 1772-87-627 B A, G, 11(1), 30, 43, 62, 71 40 Voyager Court Rexdale, Ontario Canada M9W 6L7 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(3.0), V, Z, 80, 92, 100 A(183), P, Y, 110, 120, A, J(1), Y, 160, 170, A, J(4.0), W, X, Z, 140, 150 181, 200, 230 210, 220, 230 B(270), P, Y, 110, 120, 140, 150 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Hewlett-Packard CEUS/50434 1772-729-87 B 1/ C, G, 11(1), 62 Optical Communication Div. 1772-730-87 370 West Trimble Road San Jose, CA 95131 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING 1/ A(0.73), S(AuGe), Z, 80, 1/ A(266), N(AuSi), 1/ B, J(1.5), Z, 160, 1/ B(AuSn), K(1.28), Z, 92, 102 O(AuGe)Y, 110, 120, 170, 181, 230 204, 205, 210, 212 140, 150 A, J(1), Z, 160, 171, 181, 230 1/ Listing applies to the following part numbers - 8102801EC, 8302401EC, 6N140A/883B, 8767901EC, 4N55/883B, HCPL-1900/883B. 4 CUSTOM HYBRID MICROCIRCUITS QML-38510-6 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Honeywell, Inc. CEUT/58960 1772-404-87 B A, G, 11(2), 30, 43, 64, 71 Sperry Central Mfg. 21111 North 19th Ave. Phoenix, AZ 85036 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(3.01), S(AuGe), Z, 80, A(266), P, Y, 110, 120, A, J(1), Y, 161, 170, A, I(3.5), X, Z, 202, 95, 100 140, 150, 152 181, 200, 230 210, 220 A, J(1), Y, 160, 170, 181, 200, 230 A, J(1.25), N, 160, 161, 170, 181, 200, 230 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Honeywell, Inc. CEWN/09128 1772-1715-86 B A, G, 11(3), 30, 43, 62, 71 Military Avionics Div. A, G, 11(6), 30, 62 13350 U.S. Highway 19, S. B, G, 13(1), 30, 40, 62, 71 Clearwater, FL 34624 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(2.06), V, Y, 80, 92, 104 A(240), P, Y, 110, 120, A, J(1), Y, 161, 170, A, J(2.77), W, X, Y, Z, 140, 150 181, 200, 230 202, 210, 220 A(240), P, Y, 111, 120, A, J(1), Y, 161, 170, A, I(2.0), W, X, Y, Z, 140, 150 181, 200, 232 202, 210 A(128), Q, Y, 110, 120, A, J(2), Y, 160, 170, 140, 152 181, 200, 230 B(180), P, Y, 110, 120, A, J(2), Y, 160, 170, 140, 154 181, 200, 232 A, J(2), Y, 161, 170, 181, 200, 230 A, J(2), Y, 161, 170, 181, 200, 232 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Hughes Aircraft Co. CEVS/82557 1772-628-87 B A, G, 11(3), 30, 62 Tucson Mfg. Div. P.O. Box 11337 Bldg. 809, M/S 2 Nogales Highway 1 Tucson, AZ 85706 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(6.4), V, Z, 80, 92, 104 A(244), P, Z, 111, 120, A, J(0.7), Z, 161, A, J(7.92), 202, 210 140, 150 170, 181, 200, 230 A(370), P, Z, 111, 120, A, J(1.0), Z, 161, 170, 140, 152 180, 181, 200, 230 B(250), P, Z, 111, 120, A, J(2.0), Z, 161, 140, 155 170, 180, 200, 230 E(852), P, Z, 111, 120, 140, 153 5 CUSTOM HYBRID MICROCIRCUITS QML-38510-61 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION ILC Data Device Corp. CEPB/19645 1772-232-85 B B, G, 13(1), 40, 62, 71 105 Wilbur Place A, G, 11(5), 30, 62 Bohemia, NY 11716 A, G, 11(3), 30, 43, 62, 71 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(4.75), T(AgSn), Z, 80, A(120), P, Q, Y, 110, 120, A, J(1), Y, 160, 161, A, J(7.94), 203, 210 95, 104 140, 152 170, 181, 200, 230 D, 0(5.38), 203, 210 A(4.75), V, Z, 80, 92, 104 A(332), Q, Y, 110, 120, 140, 153 A(113), P, Y, 110, 120, 140, 155 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION ITT Avionics Division CEWQ/28527 1772-872-87 B A, G, 11(4), 30, 62 100 Kingsland Road 1772-877-87 Clifton, NJ 07014 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(3.4), V, 80, 92, 100 A(414), P, Y, 110, 120, A, J(1.0-1.5), Y, A, J(4.38), X, Z, 140, 152 160, 161, 170, 181, 203, 210 B(440), P, Y, 110, 120, 200, 230 140, 155 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Interpoint Corp. CEUU/50821 1772-734-87 B A, G, 11(2), 30, 43, 62, 71 10301 Willows Road 1772-735-87 Redmond, WA 98052 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(5.2), V, Z, 80, 92, 100 A(402), Q, Y, 110, 111, A, J(1.0), Y, 160, 161 A, J(6.0), 202, 203, 120, 140, 150, 152 170, 181, 200, 230 210 A(190), P, Y, 110, 111, 120, 140, 150, 152 B(450), P, Y, 110, 111, 120, 140, 155 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Micra Corporation CETZ/63071 1772-44-87 B A, G, 11(1), 30, 43, 62, 71 120 Ricefield Lane Hauppauge, NY 11788 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(.926), S(Au), Z, 80, A(92), N(Au), Z, 110, 120, A, J(1), Z, 160, 170, D, H, L(1.12), Z, 92, 104 140, 150 181, 230 202, 210, 220 6 CUSTOM HYBRID MICROCIRCUITS QML-38510-61 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Micro Networks Co. CEVQ/50507 1772-686-87 B B, G, 13(1), 40, 62, 71 324 Clarke Street Worcester, MA 01606 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(3.306), V, Z, 80, 92, A(178.71), P, Y, 110, 120, A, J(1), Y, 160, 161, A, K(4.7), W, X, 204, 102 140, 150 170, 180, 181, 185, 210, 220 A(115.71), P, Y, 110, 120, 200, 230 140, 152 A(4.84), N(AuSi), Z, 110, 120, 140, 150 B(20.0), Q, Z, 110, 120, 140, 155 E(32.49), P, Y, 110, 120, 140, 153 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Micro-Rel Division CEUZ/8K957 1772-880-87 B C, G, 18(4), 11(1), 34, 62 Medtronic, Inc. 2343 West 10th Place Tempe, AZ 85281 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING Not Applicable A(532), P, Y, 110, 120, 140, 152 B, J, (1.25), Y, 162, B(SnAu), N(3.5), 204, 212 A(200), P, Y, 110, 120, 140, 154 170, 181, 230 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION National Semiconductor CCXP/27014 1772-762-87 B A, G, 11(1), 43, 65, 71 5900 S. Calle Santa Cruz Tucson, AZ 85706 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(.56), T(AuSn), Z, 80, A(80), N(AuSi), Z, 110, A, J(1), Y, 161, 170, A, L(.942), Z, 96, 104 120, 140, 150 181, 200, 230 202, 212 7 CUSTOM HYBRID MICROCIRCUITS QML-38510-6 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Philips Circuit Assemblies CEVR/64781 1772-053-88 B A, G, 11(2), 30, 50, 62, 71 1515 Sixth Street, South 1772-732-86 A, G, 11(3), 16(1), 30, 43, 71 Hopkins, MN 55343-7881 A, G, 11(1), 19(4), 30, 43, 71 A, G, 11(3), 20(1), 30, 43, 71 A, G, 11(1), 17(4), 30, 43, 71 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(4.26), V, Z, 80, 92, 100 A(580), P, Y, 110, 120, A, J(1.3), Y, 160, 170, A, J(5.0), W, X, 202, 140, 152 180, 181, 200, 230 203, 210 A(580), P, Y, 110, 120, A, J(2.0), Y, 160, 170, B(AuSn), N(2.24-3.80), 140, 150 180, 181, 200, 230 204, 210 B(320), P, Y, 110, 120, A, J(1,1.3), Y, 160, 140, 155 170, 181, 200, 230 A, J(1,1.3), Y, 161, 170, 181, 200, 230 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Raytheon Company CETX/94144 1772-408-87 B A, G, 11(1), 30, 43, 62, 71 Microwave & Power Tube Division Industrial Components Operation P.O. Box 5300 465 Centre Street Quincy, MA 02269 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(2.02), V, Z, 80, 92, 104 A(226), P, Y, 110, 120, A, J(1), Y, 160, 170, A, J(2.76), 202, 210 140 181, 200, 230 B(250), P, Q, Y, 110, 120, 140, 155 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Teledyne Crystalonics CCZK/12498 1772-668-87 B A, G, 11(1), 30, 43, 60, 70 147 Sherman Street Cambridge, MA 02140 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(1.20), V, Z, 80, 92, 104 A(154), P, Z, 110, 120, A, J(1), Z, 160, 170, D, L(1.65), 202, 210 140, 150 181, 200, 230 A(182), Q, Z, 110, 120, 140, 152 8 CUSTOM HYBRID MICROCIRCUITS QML-38510-61 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Teledyne Microelectronics CEOL/16170 1772-638-85 B B, G, 13(2), 40, 63, 71 12964 Panama Street 1772-1318-85 A, H, 11(7), 30, 62 Los Angles, CA 90066 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(4.04), T(AuSn), Z, 80, A(254), P, Y, 110, 120, C, J(1), Y, 160, 171, 90, 104 140, 152 181, 200, 230 A(320), P, Y, 110, 120, C, J(1.5), Y, 160, 170, A, M(5.7), W, X, 140, 152 181, 200, 230 202, 210 A(1.10), S(AuGeIn), Z, 80, A(248), P, Y, 110, 120, A, J(1), Y, 161, 170, 94, 104 140, 150 181, 200, 230 B(180), P, Y, 110, 120, E, K(2x8), Y, 160, 170, 140, 155 181, 200, 230 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Teledyne Philbrick CETY/29832 1772-1196-86 B A, G, 11(1), 30, 43, 62, 71 40 Allied Drive Dedham, MA 02026 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(1.37), V, 80, 92, 104 A(200), P, Q, 110, 120, A, J(1), 160, 170, D, L (2.00), 202, 210, 220 140, 152 181, 200, 230 E(300), Q, 110, 120, A, J(1), 161, 170, 140, 153 181, 200, 230 TEST PRODUCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION Vitarel Microelectronics CEXE/66632 1772-138-88 B A, G, 11(1), 30, 43, 62, 71 6828 Nancy Ridge Drive San Diego, CA 92121 SEALING, DELIDDING SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL AND RESEALING A(.940), V, Z, 80, 92, 105 A(.208), P, Z, 110, A, J(1), Z, 160, D, L (1.26), 202, 210 120, 140, 152 170, 181, 200, 230 9 CUSTOM HYBRID MICROCIRCUITS QML-38510-6 ATTACHMENT I MATERIALS AND MANUFACTURING CONSTRUCTION TECHNIQUES CODE TABLE C C C O PRODUCT O O D ASSURANCE D D E LEVEL E SUBSTRATE FABRICATION E SUBSTRATE ATTACH TYPE CONDUCTOR 1/ MATERIAL 2/ METHOD B Class B A Thick Film 11 Gold A Alumina 80 Manual S Class S B Thin Film 12 Aluminum B Beryllia 81 Automatic C Co-fired 13 Au/Ni Barrier C Silicon 82 Semi-Automatic 14 Copper 15 Silver 16 Pt Au 17 Pd Ag 18 Tungsten 19 Pt Pd Ag 20 Pt Pd Au BACKING MATERIAL INSULATION MATERIAL G Alumina 30 Glass 90 Gold H Beryllia 31 SiO 91 Copper I Silicon 32 Silicon-nitride 92 Alumina 33 Polyimide 93 Beryllia 34 Alumina 94 Au/NiCr 95 Pt Au 96 Pd Ag ATTACH ATTACH RESISTORS MATERIAL 3/ SURFACE 40 Nickel-chromium S Eutectic 6/ 100 Type A 5//Nickel 41 Chrome-silver T Solder 6/ 101 Copper 42 Tantalum U Polymer- 102 Ceramic Package 43 Cermet conductive 103 Alumina Substrate V Polymer- 104 Type A 5//Nickel/Gold nonconductive 105 Gold REATTACH CAPACITORS QUALIFIED 50 Glass Y Yes 51 TaN Z No 52 Si0 53 Si02 BACKING MATERIAL 60 Gold 61 Silicon 62 Alumina 63 Au/NiCr 64 Pt Au 65 Pd Ag RESISTOR TRIMMING 70 Abrasive 71 Laser-passive NOTES: 1/ Maximum number of levels successfully tested indicated in parenthesis next to number on QML. 2/ Largest perimeter successfully tested in inches indicated in parenthesis next to letter on QML. 3/ All adhesive and polmeric material shall be approved by acquiring activity. 5/ See MIL-M-38510, paragraph 3.5.6.1. 6/ Type of solder or eutectic in parenthesis. 10 CUSTOM HYBRID MICROCIRCUITS QML-38510-6 y ATTACHMENT I (Continued) MATERIALS AND MANUFACTURING CONSTRUCTION TECHNIQUES CODE TABLE (Continued) C C O O D D E DIE AND ELEMENT ATTACH E BONDING, INTERNAL ELEMENT CONFIGURATION 2/ METHOD TECHNIQUE METHOD A Unpackaged die 110 Manual A Thermosonic 160 Manual B Chip capacitor 111 Automatic B Thermocompression 161 Automatic C Leadless chip carrier 112 Semi-Automatic C Ultrasonic 162 Semi-automatic D Tape auto bond D Soldering E Chip resistor E Parallel gap weld SUBSTRATE ATTACH MATERIAL 3/ MATERIAL TYPE 4/ MATERIAL N Eutectic 6/ 120 Alumina J Wire 170 Gold O Solder 6/ 121 Beryllia K Ribbon 171 Aluminum P Polymer-conductive L Mesh 172 Copper Q Polymer-nonconductive M Solder 173 Solder ELEMENT REATTACH CONDUCTOR REBONDING BONDING PAD QUALIFIED MATERIAL QUALIFIED MATERIAL Y Yes 140 Gold Y Yes 180 Gold Z No 141 Aluminum Z No 181 Aluminum 142 Nickel 182 Nickel 143 Copper 183 Copper 144 Silver 184 Silver 185 Silver Palladium ELEMENT BACKING PACKAGE POST MATERIAL PLATING 150 Gold 200 Gold 151 Copper 201 Nickel 152 Silicon 202 Au/Ni Barrier 153 Ceramic 154 Silver Platinum 155 Silver Palladium SUBSTRATE 156 Silver BONDING PAD MATERIAL 230 Gold 231 Aluminum 232 Au/Ni Barrier 233 Copper 234 Silver 235 Pt Au 236 Pd Ag NOTES: 2/ Largest perimeter successfully tested in mils indicated in parenthesis next to letter on QML. 3/ All adhesive and polmeric material shall be approved by acquiring activity. 4/ Minimum/maximum diameter or area tested in mils in parenthesis next to letter on QML. 6/ Type of solder or eutectic in parenthesis. 11 CUSTOM HYBRID MICROCIRCUITS QML-38510-6a ATTACHMENT I (Continued) MATERIALS AND MANUFACTURING CONSTRUCTION TECHNIQUES CODE TABLE (Continued) C O D SEALING, DELIDDING AND RESEALING E TECHNIQUE PACKAGE MATERIAL/PLATING A Seam Weld 200 Copper B Solder 6/ 201 Brass C Glass Frit 202 Type A 5//Nickel/Gold D Projection Weld 203 Type A 5//Nickel 204 Ceramic 205 Type B 5/ 206 Type C 5/ 207 ASTM 1010/Nickel PACKAGE TYPE 2/ LEAD FINISH I Metal Package, Peripheral Leads 210 Gold J Metal Package, Axial Leads 211 Tin K Ceramic Dual-In-Line-Package 212 Solder L TO Can M Ceramic Flat Package N Leadless Chip Carrier O Platform REWORK QUALIFIED RESISTOR TRIMMING W Seal 220 Laser-active X Delid Y New Package Z Remarking NOTES: 2/ Largest perimeter successfully tested in inches indicated in parenthesis next to letter on QML. 5/ See MIL-M-38510, paragraph 3.5.6.1. 6/ Type of solder or eutectic in parenthesis. 12 of 12 CUSTOM HYBRID MICROCIRCUITS QML-38510-6  Remarking NOTES: 2/ Largest perimeter successfully tested in inches indicated in parenthesis n