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Can Xilinx Devices be wave soldered or immersed in solder?


Record #1347

Problem Title:
Can Xilinx Devices be wave soldered or immersed in solder?


Problem Description:
Can Xilinx Devices be wave soldered or immersed in solder?

What are the guidelines if the device is to be wave soldered?


Solution 1:

Since most of Xilinx device packages are manufactured out of plastic, it is not
suggested to wave solder or immerse the device in solder.

If the device is to be wave soldered, special care must be made to ensure that t
he maximum temperature of the package body does not exceed 220 degrees C and tha
t all of the components are kept in a dry condition.  Unless specifically stated
 for any package type, dry condition implies less than 0.12% of moisture by pack
age weight.

Refer to pages 11-18 to 11-20 of the 1996 Xilinx Programmable Logic Data Book fo
r more information on handling components that are moisture sensitive.



End of Record #1347