Answers Database

XC9500: Test process of devices before shipment


Record #1700

Product Family:  Hardware

Product Line:  9500

Problem Title:
XC9500:	Test process of devices before shipment


Problem Description:
What tests have been run to verify that 9500 devices are
functional before they are shipped?


Solution 1:

The test sequence involves the following steps:

1) Wafer sort #1
       Logic functional tests, program/erase tests
       (all cells left in programmed state).

       After this test, the wafer is baked at a high
       temperature to test for cell leakage (= charge loss).
       The bake is at 250 deg C for 24 hours.

2) Wafer sort #2
       Programmed cells are checked for threshold voltage
       changes as a result of wafer bake.  After this test,
       bad devices (failing either wafer sort #1 or #2)
       are marked. All good devices are sent to be packaged.

3) Final test
       Full logic functional tests and full program/erase
       tests. After this test, the good devices are
       speed-binned, marked, and shipped.

The XC9500 devices are fully tested during "final test", which
is the stage when the packaged units return from packaging, and
just before the devices are marked and shipped. During final
test, every XC9500 device is fully tested for program/verify
(both JTAG/ISP and non-ISP modes) and logic functionality
(using both programmed cells and special test circuitry).



End of Record #1700