Answers Database

Why isn't there a PCB footprint for any of Ceramic BRAZED CQFP package(CB100,CB164,CB196,CB228)


Record #1726

Product Family:  Documentation

Product Line:  Packages

Problem Title:
Why isn't there a PCB footprint for any of Ceramic BRAZED CQFP
package(CB100,CB164,CB196,CB228)



Problem Description:
Why isn't there a PCB footprint for any of Ceramic BRAZED CQFP package(CB100,CB1
64,CB196,CB228)?


Solution 1:

The reason is that Xilinx doesn't do the pin forming for any ceramic brazed pack
age.  It is up to the pin forming vendor and customer how they want the pins to
be shaped and formed. We have a list of recommended vendors in solution 127 wher
e customers can go to and get a spec for different packages.



End of Record #1726