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TABLE 1A

Plastic Package / Product Qualification Requirements per Die Size

TEST SEQ
TEST DESCRIPTION
 ACC#/SAMPLE SIZE PER DIE SIZE CATEGORY (Note #2)
NEW PKG TYPE I
NEW PKG TYPE II
NEW PKG TYPE III LF DESIGN
LEAD FRAME
DIE ATTACH
DIE COAT
WIRE 
BOND
MOLD CPD
LEAD FINISH
NEW DEVICE MASK
NEW FAB PROCESS
FULL
QUAL
   
(Note #1)
  
CAT.1
CAT.2
CAT.3
(Note #3)
(Note #4)
(Note #5)
            
(Note #6)
  
(Note #9)
B1
   Solder Heat Test (Optn'l)  
0/15
0/15
0/15
    
X
X
      
X
      
X
B2
*
 Resist. to Solvents
(Note #7)
0/3
0/3
0/3
X
            
X
X
    
X
B3
*
 Solderability Test
(Note #7)
0/3
0/3
0/3
X
X
  
X
        
X
    
X
B4
*
 Die Shear
(Note #7)
0/5
0/5
0/5
X
  
X
  
X
          
X
X
B5
*
 Ball Shear/Bond Pull
(Note #7)
0/5
0/5
0/5
X
    
X
  
X
X
X
    
X
X
B6
*
 External Visual
(Note #7)
0/25
0/25
0/25
X
X
X
X
      
X
      
X
B7
   Internal Visual
(Note #7)
0/5
0/5
0/5
X
X
X
X
X
X
X
    
X
X
X
B8
*
 S.A.T./Dye Pen Test
(Note #7)
0/5
0/5
0/5
X
X
X
X
      
X
X
    
X
B9
   Auto Clave (SPP)(optn'l) 0/76  
0/76
0/32
0/22
X
X
X
X
  
X
  
X
      
X
B10
**
 X-Ray
(Note #7)
0/5
0/5
0/5
X
X
X
    
X
X
X
      
X
B11
   Flammability Test
(Note #7)
Per lot
Per lot
Per lot
              
X
      
X
B12
*
 Lead Material/Plating Thickness  
0/3
0/3
0/3
X
    
X
        
X
    
X
B13
   Process Cross Section  
2
2
2
                    
X
X
C1-A
   High Temp Life Test  
0/76
0/32
0/22
                  
X
X
X
C1-B
   Low Temp Life Test
(Note #7)
0/22
0/22
0/22
                    
X
X
C2
   C2-A: HAST (0/22) or C2-B: 85/85  
0/76
0/32
0/22
X
  
X
X
X
X
  
X
    
X
X
C3
   ESD (HBM)
(Note #8)
0/3 (9)
0/3 (9)
0/3 (6)
                  
X
  
X
C4
   High Temp Storage (Optn'l)  
0/77
0/32
0/22
              
X
    
X
X
D1
*
 Phy. Dimension  
0/5
0/5
0/5
X
X
          
X
X
    
X
D2
*
 Lead Integrity  
0/3
0/3
0/3
X
X
  
X
        
X
    
X
D7
*
 Adhesion of L/Finish (Optn'l)
(Note #7)
0/3
0/3
0/3
X
    
X
        
X
    
X
D9
   Temp Cycle  
0/76
0/32
0/22
X
X
X
X
X
X
X
X
    
X
X
D10
   Thermal Shock (Optn'l)  
0/76
0/32
0/22
                      
X
E1
   Electrical Test & Data Log  
0/30
0/20
0/10
                  
X
X
X
E2
   Electrical Characterization  
0/30
0/30
0/30
                  
X
X
X
E3
   T.D.D.B.
(Note #7)
-
-
-
                    
X
X
E4
   Latch-Up  
0/10
0/10
0/4
                  
X
  
X
E5
   Electromigration
(Note #7)
-
-
-
                    
X
X
E6
   Photosensitivity (Optn'l)  
0/11
0/11
0/11
                  
X
X
X
E7
   Data Retention Bake (EPLD & EPROM)  
0/45
0/22
0/15
                  
X
X
X
E8
   Input/Output Capacitance  
0/5
0/5
0/3
                  
X
  
X
E9
   Power Cycling  
0/76
0/32
0/22
                  
X
X
X
Qty required per lot  
Electrically good
238/106/76
162/74/54
253/121/91
248/116/86
157/69/49
238/106/76
86/74/54
325
5
297/176/128
455/202/135
811/470/372
Electrical rejects
60
41
35
40
5
5
5
43
25
0
10
60
Total Units Required
298/166/136
203/115/95
288/156/126
288/115/95
162/74/54
243/111/81
91/79/59
368
30
297/176/128
465/212/145
871/530/432
 
1)
 Refer to Table #2 for test method and stress conditions.
2)
 Category 1 die size is <.571" x .643"; Category 2 die size is <.764" x .864"; Category 3 die size is >/=.764" x .864". Refer to Section 8.1.
3)
 Qualification of a new assembly plant, or, any new package which has not been qualified in the qualified assembly facility.
4)
 Any new package where the same package body size with different lead pitch has been qualified.
5)
 New leadframe design whereby the paddle size is larger than the existing largest leadframe paddle size used in the same qualified package.
6)
 For new mask from same device family, HTOL may or may not be required; ESD, LU, CAP and CHARDATA are required.
7)
 In process monitor data may be used to satisfy this requirement.
8)
 Acceptance criteria is 0/3, however 9 or 6 devices are required for ESD design characterization.
9)
 A full qualification is for process, assembly site and package.
*
 Electrical rejects can be used as test sample.
**
 This is a non-destructive test; sample can be re-used.
 
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