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ACC#/SAMPLE SIZE PER DIE SIZE CATEGORY (Note #2) |
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Solder Heat Test (Optn'l) |
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Resist. to Solvents |
(Note #7)
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Solderability Test |
(Note #7)
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Die Shear |
(Note #7)
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Ball Shear/Bond Pull |
(Note #7)
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External Visual |
(Note #7)
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Internal Visual |
(Note #7)
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S.A.T./Dye Pen Test |
(Note #7)
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Auto Clave (SPP)(optn'l) 0/76 |
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X-Ray |
(Note #7)
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Flammability Test |
(Note #7)
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Lead Material/Plating Thickness |
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Process Cross Section |
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High Temp Life Test |
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Low Temp Life Test |
(Note #7)
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C2-A: HAST (0/22) or C2-B: 85/85 |
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ESD (HBM) |
(Note #8)
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High Temp Storage (Optn'l) |
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Phy. Dimension |
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Lead Integrity |
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Adhesion of L/Finish (Optn'l) |
(Note #7)
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Temp Cycle |
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Thermal Shock (Optn'l) |
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Electrical Test & Data Log |
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Electrical Characterization |
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T.D.D.B. |
(Note #7)
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Latch-Up |
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Electromigration |
(Note #7)
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Photosensitivity (Optn'l) |
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Data Retention Bake (EPLD & EPROM) |
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Input/Output Capacitance |
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Power Cycling |
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Qty required per lot |
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Refer to Table #2 for test method and stress conditions. |
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Category 1 die size is <.571" x .643"; Category 2 die size is <.764" x .864"; Category 3 die size is >/=.764" x .864". Refer to Section 8.1. |
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Qualification of a new assembly plant, or, any new package which has not been qualified in the qualified assembly facility. |
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Any new package where the same package body size with different lead pitch has been qualified. |
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New leadframe design whereby the paddle size is larger than the existing largest leadframe paddle size used in the same qualified package. |
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For new mask from same device family, HTOL may or may not be required; ESD, LU, CAP and CHARDATA are required. |
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In process monitor data may be used to satisfy this requirement. |
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Acceptance criteria is 0/3, however 9 or 6 devices are required for ESD design characterization. |
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A full qualification is for process, assembly site and package. |
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Electrical rejects can be used as test sample. |
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This is a non-destructive test; sample can be re-used. |