TABLE 1A

Plastic Package / Product Qualification Requirements per Die Size

TEST SEQ

TEST DESCRIPTION

ACC#/SAMPLE SIZE PER DIE SIZE CATEGORY (Note #2)

NEW PKG TYPE I

NEW PKG TYPE II

NEW PKG TYPE III LF DESIGN

LEAD FRAME

DIE ATTACH

DIE COAT

WIRE
BOND

MOLD CPD

LEAD FINISH

NEW DEVICE MASK

NEW FAB PROCESS

FULL
QUAL

(Note #1)

CAT.1

CAT.2

CAT.3

(Note #3)

(Note #4)

(Note #5)

(Note #6)

(Note #9)

B1

Solder Heat Test (Optional)

0/15

0/15

0/15

X

X

X

X

B2

*

Resist. to Solvents

(Note #7)

0/3

0/3

0/3

X

X

X

X

B3

*

Solderability Test

(Note #7)

0/3

0/3

0/3

X

X

X

X

X

B4

*

Die Shear

(Note #7)

0/5

0/5

0/5

X

X

X

X

X

B5

*

Ball Shear/Bond Pull

(Note #7)

0/5

0/5

0/5

X

X

X

X

X

X

X

B6

*

External Visual

(Note #7)

0/25

0/25

0/25

X

X

X

X

X

X

B7

Internal Visual

(Note #7)

0/5

0/5

0/5

X

X

X

X

X

X

X

X

X

X

B8

*

S.A.T./Dye Pen Test

(Note #7)

0/5

0/5

0/5

X

X

X

X

X

X

X

B9

Auto Clave (SPP) (optional) 0/76

0/76

0/32

0/22

X

X

X

X

X

X

X

B10

**

X-Ray

(Note #7)

0/5

0/5

0/5

X

X

X

X

X

X

X

B11

Flammability Test

(Note #7)

Per lot

Per lot

Per lot

X

X

B12

*

Lead Material/Plating Thickness

0/3

0/3

0/3

X

X

X

X

B13

Process Cross Section

2

2

2

X

X

C1-A

High Temp Life Test

0/76

0/32

0/22

X

X

X

C1-B

Low Temp Life Test

(Note #7)

0/22

0/22

0/22

X

X

C2

C2-A: HAST (0/22) or C2-B: 85/85

0/76

0/32

0/22

X

X

X

X

X

X

X

X

C3

ESD (HBM)

(Note #8)

0/3 (9)

0/3 (9)

0/3 (6)

X

X

C4

High Temp Storage (Optional)

0/77

0/32

0/22

X

X

X

D1

*

Physical Dimension

0/5

0/5

0/5

X

X

X

X

X

D2

*

Lead Integrity

0/3

0/3

0/3

X

X

X

X

X

D7

*

Adhesion of Lead Finish (Optional)

(Note #7)

0/3

0/3

0/3

X

X

X

X

D9

Temp Cycle

0/76

0/32

0/22

X

X

X

X

X

X

X

X

X

X

D10

Thermal Shock (Optiona)

0/76

0/32

0/22

X

E1

Electrical Test & Data Log

0/30

0/20

0/10

X

X

X

E2

Electrical Characterization

0/30

0/30

0/30

X

X

X

E3

T.D.D.B.

(Note #7)

-

-

-

X

X

E4

Latch-Up

0/10

0/10

0/4

X

X

E5

Electromigration

(Note #7)

-

-

-

X

X

E6

Photosensitivity (Optional)

0/11

0/11

0/11

X

X

X

E7

Data Retention Bake (EPLD & EPROM)

0/45

0/22

0/15

X

X

X

E8

Input/Output Capacitance

0/5

0/5

0/3

X

X

E9

Power Cycling

0/76

0/32

0/22

X

X

X

E10

CDM

-

-

-

X (Note #10)

X

X

Qty required per lot

Electrically good

238/106/76

162/74/54

253/121/91

248/116/86

157/69/49

238/106/76

86/74/54

325

5

297/176/128

455/202/135

811/470/372

Electrical rejects

60

41

35

40

5

5

5

43

25

0

10

60

Total Units Required

298/166/136

203/115/95

288/156/126

288/115/95

162/74/54

243/111/81

91/79/59

368

30

297/176/128

465/212/145

871/530/432

1)	Refer to Table #2 for test method and stress conditions.
2)	Category 1 die size is <.571" x .643"; Category 2 die size is <.764" x .864"; Category 3 die size is >/=.764" x .864".
3)	Qualification of a new assembly plant or any new package which has not been qualified in a qualified assembly facility.
4)	Any new package where the same package body size with different lead pitch has been qualified.
5)	New leadframe design whereby the paddle size is larger than the existing largest leadframe paddle size used in the same qualified package.
6)	For new mask from same device family, HTOL may or may not be required; ESD, LATCH-UP, CAPACITANCE and CHARACTERIZATION DATA are required.
7)	In process monitor data may be used to satisfy this requirement.
8)	Acceptance criteria is 0/3, however 9 or 6 devices are required for ESD design characterization.
*	Electrical rejects can be used as test sample.
**	This is a non-destructive test; sample can be re-used.
9)	A full qualification is for process, assembly site and package.
10)	New device/new process - 1000 volt minimum.