TABLE 2B

Hermetic Package / Product Monitor Requirements and Test Conditions

TEST SEQ	TEST DESCRIPTION	REFERENCE SPEC Mil-Std-883 / JEDEC/STACK	XILINX	TEST OR STRESS CONDITIONS	PRODUCT MONITOR SAMPLE SIZES			PRODUCT MONITOR FREQUENCY	Notes (#1)
B	PACKAGE/PROCESS				CAT.1	CAT.2	CAT.3
B1	Solder Heat Test (Optional)	JEDEC Mtd A112	D1005 RTP0024	Immersion in solder @ 260 °C for 12 sec End-point electrical parameter @ 25 °C	-			For Qualification only
B2	Resistance to Solvents	Mil-Std-883 Mtd 2015	B1026	1 device per chemical for 1 minute, then brush 10 times	0/3			In-line Process Monitor
B3	Solderability Test	Mil-Std-883 Mtd 2003 STACK 0001 Test 5	B1023 RTP0024	8 hrs steam age: TH: 245 °C / 5 sec SMC: 215 °C for 5 sec (wetting) SMC: 260 °C for 10 sec (dewetting)	0/22 (3 units)			In-line Process Monitor	#2, #11
B4	Die Shear / Stud Pull	Mil-Std-883 Mtd 2019	N/A	Die Shear strength > 5.0 kg	0/5			In-line Process Monitor	#11
B5	Bond Pull	Mil-Std-883 Mtd 2011	N/A	Bond Pull strength > 2 gm	0/15 (4 units)			In-line Process Monitor	#6, #11
B6	External Visual	Mil-Std-883 Mtd 2009	N/A	Package defects, Lead defects	0/25			In-line Process Monitor	#11
B7	Internal Visual	Mil-Std-883 Mtd 2010	N/A	Die defects, die-attach defects and wirebond defects	0/5			In-line Process Monitor	#11
B12	Lead Material/Plating Thickness (Optional)				-
B13	Process Cross-Section			Cross-Section shall be performed by the fabrication facility or by the Xilinx Process Technology Department. For Qualification: all layers are shown with measurements. For Monitors: vias, contacts and metal step coverage measurements are required.	-
C	MICRO CIRCUIT FAMILY
C1-A	High Temp Life Test	Mil-Std-883 Mtd 1005	RTP0003	125 °C / 168, 500 and 1000 hrs or equivalent End-point electrical test @ 25 °C, verify device parameter drift (<10%)	LTPD 5 0/45	LTPD 7 0/32	LTPD 10 0/22	1x / 6 months	#3, #4, #5, #8
C1-B	Low Temp Life Test	Mil-Std-883 Mtd 1005	N/A	< -10 ° C/1000 hrs End-point electrical test @ 25 °C, verify device parameter drift (<10%)	-			In-line Process Monitor	#11
C3	ESD (HBM)	Mil-Std-883 Mtd 3015	TSP0001 RTP0032	3 positive and 3 negative pulses, all pins tested, 2000 volts min.	-			For Qualification only
C4	High Temp Storage (Optional)	Mil-Std-883 Mtd 1008	RTP0028	150 °C / 500, 1000 hrs End-point electrical test @ 25 °C	-			For Qualification only
D	PACKAGE DESIGN
D1	Physical Dimension	Mil-Std-883 Mtd 2016	B1027	Per applicable package outline drawing	0/5			1x / 6 months	#2, #8
D2	Lead Integrity Seal (Fine/Gross)	Mil-Std-883 Mtd 2004 Mil-Std-883 Mtd 2028 Mil-Std-883 Mtd 1014	B1063/62 B1064 B1024	Condition B2 (Use Condition B1 for leaded chip carrier pkgs Condition A, Tracer gas (He) fine leak & Condition C, Perfluorocarbon gross leak	0/45 (3 units)			1x / 6 months	#2, #6, #7, #8
D3	Thermal Shock + Temp Cycle + Moisture Resistance Seal (Fine/Gross)	Mil-Std-883 Mtd 1011 Mil-Std-883 Mtd 1010 Mil-Std-883 Mtd 1004 Mil-Std-883 Mtd 1014	B1001 B1002 B1049 B1005	Condition C, -65/150 °C (Liquid to Liquid), 15 cycles Condition C, -65/150 °C (Air to Air), 100 cycles 90% RH/ -10/25/65 °C, 10 cycles Condition A, Tracer gas (He) fine leak & Condition C, Perfluorocarbon gross leak	0/15			1x / 6 months	#2, #8, #9
	Visual Examination	Mil-Std-883 Mtd 1011 & Mtd 1004	B1006 B1007	Per visual criteria in Method 1011 and Method 1004 End-point electrical Test @ 25 °C
D4	Mechanical Shock + Variable Frequency Vibration + Constant Acceleration Seal (Fine/Gross)	Mil-Std-883 Mtd 2002 Mil-Std-883 Mtd 2007 Mil-Std-883 Mtd 2001 Mil-Std-883 Mtd 1014	B1083 B1076 B1008 B1005	Condition B, 1500 G Peak, 0.5 msec pulse duration Condition A, at peak acceleration of 20 g Condition E - For Pkg < 5 gms or inner sealed cavity < 2 inches Condition D - For Pkg >= 5 gms or inner sealed cavity >= 2 inches Condition A, Tracer gas (He) fine leak &	0/15			1x / 6 months	#2, #8
	Visual Examination	Mil-Std-883 Mtd 1011 & Mtd 1004	B1006 B1007	Condition C, Perfluorocarbon gross leak Per visual criteria in Method 1011 and Method 1004 End-point electrical test @ 25 °C
D5	Salt Atmosphere Visual Examination Seal (Fine/Gross)	Mil-Std-883 Mtd 1009 Mil-Std-883 Mtd 1009 Mil-Std 883 Mtd 1014	B1050 B1027 B1005 B1006	Condition A, soak time = 24 hrs Per visual criteria in method 1009 Condition A, Tracer gas (He) fine leak & Condition C, Perfluorocarbon gross leak	-			For Qualification only
D6	Internal Vapor Content	Mil-Std-883 Mtd 1018	B1010	5000 ppm max. at 100 °C	0/3			1x / 6 months	#2, #8, #11
D7	Adhesion of Lead Finish (Optional)	Mil-Std-883 Mtd 2025	B1018	Bend Coated lead at an angle of 90° until fracture occurs. No flaking, peeling or detachment of coating at the interface.	-			For Qualification only
D8	Lid Torque	Mil-Std-883 Mtd 2024	B1048	Applicable to Glass Frit Sealed Package only The Torque value must meet the minimum limits as specified in Table #1 of the Mil-Std-883 Method 2024.2	0/5			1x / 6 months	#2, #8
D9	Temp Cycle Seal (Fine/Gross)	Mil-Std-883 Mtd 1010 Mil-Std-883 Mtd 1014	B1002 B1005 B1006	Condition C -65/150 °C, 500 cycles Condition A, Tracer gas (he) fine leak & Condition C, Perfluorocarbon gross leak End-point electrical test @ 25 °C	LTPD 5 0/45	LTPD 7 0/32	LTPD 10 0/22	1x / 6 months	#2, #5
E	ELECTRICAL ENDURANCE/EVALUATION & PROCESS VALIDATION DATA
E1	Electrical Test & Datalog	STACK 0001, Test 1c		@ 25 °C, Top min. & Top max.	-			New Prod. Characterization
E2	Electrical Characterization	STACK 0001, Test 1d		Schmoo plot & Temperature trends for critical parameters	-			New Prod. Characterization
E3	T.D.D.B.	STACK 0001, Test 38		Characterization of oxide integrity	-			In-line Process Monitor	#10, #11
E4	Latch-Up	JEDEC-STD-17	TSP0006	a) Immunity to PSOV of 20% over absolute Maximum voltage b) Immunity to +/-200mA current injection into I/O pins	-			New Prod. Characterization
E5	Electromigration	STACK 0001, Test 39		Characterization of Metallisation system > 100,000 hours for 0.1% cumulative failures > 100,000 hours for 50% cumulative failures	-			In-line Process Monitor	#11
E6	Photosensitivity (Optional)	STACK 0001, Test 37		Apply 25W neon bulb, distance = 50 cm during electrical test.				New Prod. Characterization
E7	Data Retention Bake	Mil-Std-883 Mtd 1033	RTP0028	Write device with suitable pattern, bake @ 150 °C for 1000 hrs Read and confirm data pattern End-point electrical test @ 25 °C	-			New Prod. Characterization	#12
E8	Input/Output Capacitance	Mil-Std-883 Mtd 3012	RTP0031	Biased @ nominal operating voltage	-			New Prod. Characterization
E9	Power Cycling		RTP0029	5000 cycles @ 50 °C with Vcc = 5.0V Vpp = 12 to 12.5 V	-			New Product Characterization

Notes:

1)
For any Qualification or Product Monitor where sample size does not meet the Standard Quality level, approval from Product Engineering and Product QA is required.

2) The Product Monitor Frequency applies to each package family with assembly locations and package type rotated each Quarter (when applicable). If only one package type exists within a package family, the product monitor frequency will be 1x / 12 months, minimum.

3) The Product Monitor Frequency applies to each Micro Circuit Family. Plastic monitor data may be used to satisfy this requirement.

4) End-point electrical test shall be performed within 48 hrs window.

5) Interim read point is optional.

6) The sample size is for numbers of bonds or numbers of leads.

7) For LCC packages, use LTPD 15, 15 (0,1).

8) Military QCI monitor data may be used to satisfy this requirement.

9) End-point electrical test @ 25 °C shall be performed within 48 hrs after moisture resistance test.

10) T.D.D.B. - Time Dependent Dielectric Breakdown

11) In process monitor data may be used to satisfy the Qualification requirement; refer to Assembly Qualification lot traveller or Fab monitor data.

12) Not applicable to FPGA's; H.T.O.L. test data @ 150 +0/-5 °C may be used to satisfy this requirement.

1)	For any Qualification or Product Monitor where sample size does not meet the Standard Quality level, approval from Product Engineering and Product QA is required.
2)	The Product Monitor Frequency applies to each package family with assembly locations and package type rotated each Quarter (when applicable). If only one package type exists within a package family, the product monitor frequency will be 1x / 12 months, minimum.
3)	The Product Monitor Frequency applies to each Micro Circuit Family. Plastic monitor data may be used to satisfy this requirement.
4)	End-point electrical test shall be performed within 48 hrs window.
5)	Interim read point is optional.
6)	The sample size is for numbers of bonds or numbers of leads.
7)	For LCC packages, use LTPD 15, 15 (0,1).
8)	Military QCI monitor data may be used to satisfy this requirement.
9)	End-point electrical test @ 25 °C shall be performed within 48 hrs after moisture resistance test.
10)	T.D.D.B. - Time Dependent Dielectric Breakdown
11)	In process monitor data may be used to satisfy the Qualification requirement; refer to Assembly Qualification lot traveller or Fab monitor data.
12)	Not applicable to FPGA's; H.T.O.L. test data @ 150 +0/-5 °C may be used to satisfy this requirement.