| 3 August 2000
Subject: Product Change Notification (PCN00003). A change
in the die-attach material for all thermally enhanced BGA packages.
Products Affected: All packages assembled as SBGA or VBGA.
Change Description: The die-attach material for all thermally
enhanced BGA packages is being changed from QMI-595 to Hitachi EN4900 (or
AMK-02 - Amkor's internal part number).
Qualification Data: Reference attached qualification
data.
Reason For Change: This change is being made for better
product reliability and for process improvement.
Key Dates: Products assembled starting with date code
0044.
Response: No response to this notification is required.
Requests for additional data or support should be made within 90 days of
notification. Please address any other questions you may have via e-mail
at pcn@xilinx.com,
or directly by fax at (408) 559-1368.
Sincerely,
Cong Nguyen
Quality Assurance |
