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1995 Product Change Notifications
| Number |
Description |
Effective Date |
| PCN95013 |
A minor change in the part marking methodology utilized
for Xilinx Products |
Dec 26, 1995 |
| PCN95010B |
An update to PCN95010A |
Jul 1, 1997 |
| PCN95010A |
An update to PCN95010 |
Jun 28, 1996 |
| PCN95010 |
A New Manufacturer for the Xilinx Serial Configuration PROM's &
Obsolescence of the Existing PROM Products |
Dec 18, 1995 |
| PCN95009 |
Qualification of the Advanced Semiconductor Engineering,
Inc. (ASE) Assembly Facility to Assemble Plastic Quad Flat Packs (TQ, PQ)
for Xilinx Products |
Dec 11, 1995 |
| PCN95008 |
Qualification of AAPI-1 Assembly Facility to Assemble Plastic Quad
Flat Packs (TQ, PQ) for Xilinx Products |
Dec 11, 1995 |
| PCN95007 |
Qualification of Integrated Packaging Assembly Corporation (IPAC) as
a New Assembly Subcontractor |
Dec 11, 1995 |
| PCN95006 |
A minor change to the electrical specifications of some Xilinx Ceramic
Packaged Devices |
Aug 22, 1995 |
| PCN95005 |
An Evolutionary Change in the Xilinx XC7000 Fabrication Process |
Aug 10, 1995 |
| PCN95004 |
Qualification of ASTRA Microtronics Technology as a New Assembly Subcontractor |
Jun 30, 1995 |
| PCN95003 |
Withdrawal of the XC1765DDD8R (Obsolete Device) |
Apr 17, 1995 |
| PCN95002B |
PCN Update: An Evolutionary Change in the Xilinx Wafer Fabrication
Process |
Jun 18, 1996 |
| PCN95002A |
PCN Update: An Evolutionary Change in the Xilinx Wafer Fabrication
Process |
Aug 11, 1995 |
| PCN95002 |
An Evolutionary Change in the Xilinx XC4000 Fabrication Process |
Apr 6, 1995 |
| PCN95001 |
Addition of a New Process for the Xilinx XC1718D, XC1736D, and XC1765D
Serial Configuration PROMs |
Mar 31, 1995 |
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