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22 August, 1995
Subject: Process Change Notification (PCN95006) - A minor change to the electrical specifications of some Xilinx Ceramic Packaged Devices.
Products Affected: XC3000/A, XC3100/A, and XC4000 (in ceramic packages PG120, 132, 156, and 175, PG191, 223 and 299, and CB164, 196, and 228 only).
Change Description: The maximum pin capacitance on these products ( exclusive of XTL1 and XTL2) is being increased to 16pf. This change effects only the ceramic packaged products listed above.
Reason For Change: Xilinx continuing pursuit of faster products fabricated with advanced technologies while simultaneously establishing a more robust ESD protection structure has resulted in a small shift in the distribution of pin capacitance, necessitating a minor change in the specification (for ceramic packages only). More than adequate margins exist in plastic parts such that no specification change in necessary for plastic parts.
Response: No response to this notification is required. Requests for additional data or support should be made within 90 days of notification. Please address any questions you via email to "pcn@xilinx.com" or directly by fax at 408 559 1368.
Joseph J. Fabula
Director Q/A