Thermal Data for PCN 97009A
Thermally Enhanced Plastic Quad Flat Pack (PQFP)

Still Air Data Comparison:

	HQFP  (Current Non-Insulated)	HQFP  (Insulated)	PQFP  (Std)
	JA (°C/watt)	JA (°C/watt)	JA (°C/watt)
208 pins	14 - 15	14 - 16	25 - 32
240 pins	11 - 14	11 - 15	18 - 28

 

Notes:

1.	JC Data:      HQFP (Thermally Enhanced) = 0.7 - 1.2°C/watt, typical.      PQFP (Standard PQFP) = 2.0 - 7.0°C/watt, typical.
2.	Test Conditions per JEDEC JC15.1.
3.	Data measured using a 4-layer test board.
4.	Used Delco Thermal Die. Die sizes vary, compatible to Xilinx device sizes.