Product Change Notification
PCN2000-08

December 29, 2000

Attention Valued Customer,

Subject:  Additional equivalent wafer foundries for fabrication of Virtex™ commercial (C-grade and I-grade) product family. 

Products Affected: The following commercial (C-grade and I-grade) members of Virtex product line are affected: XCV300, XCV400, XCV600, XCV800 and XCV1000. Note that this notice does not affect any Virtex-E™ devices.

Change Description: The Virtex product family is currently manufactured using 0.22µ 5 layer metal process. A new 0.22µ / 0.18µ 6 layer metal process at additional equivalent foundries will be used to manufacture the Virtex product family. Virtex products produced from the 0.22µ / 0.18µ process will be performance, form, fit and functionally equivalent to the current product.

Reason for Change: This change is being made to establish additional sources for the Virtex product family to ensure continuity of supply. Qualification data on Virtex (0.22µ and 0.18µ) product is attached.

Key Dates: Xilinx will begin shipping Virtex products fabricated with the 0.22µ / 0.18µ process on the following schedule:
 
Device: Sample Devices Available From: Production Devices Available From:
XCV1000 Early December 2000 Mid March 2001
XCV800 Early February 2001 Mid April 2001
XCV600 Mid March 2001 Late May 2001
XCV400 Late March 2001 Early June 2001
XCV300 Late March 2001 Early June 2001

Each additional equivalent foundry will be assigned a unique identifier. Advisory notification will be sent within 30 days prior to sample shipments.

Response: No response to this notification is required. Requests for additional data or support should be made within 90 days of notification. Please address any questions you may have via email at pcn@xilinx.com, or directly by fax at 408 369 1718.


 
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