|
TEST SEQ
|
TEST DESCRIPTION
|
ACC#/SAMPLE SIZE PER DIE SIZE
CATEGORY (Note #2) |
NEW PKG TYPE I
|
NEW PKG TYPE II
|
NEW PKG TYPE III LF DESIGN
|
LEAD FRAME
|
DIE ATTACH
|
DIE COAT
|
WIRE
BOND
|
MOLD CPD
|
LEAD FINISH
|
NEW DEVICE MASK
|
NEW FAB PROCESS
|
FULL
QUAL
|
| |
|
(Note #1)
|
|
CAT.1
|
CAT.2
|
CAT.3
|
(Note #3)
|
(Note #4)
|
(Note #5)
|
|
|
|
|
|
|
(Note #6)
|
|
(Note #9)
|
|
B1
|
|
Solder Heat Test (Optional) |
|
0/15
|
0/15
|
0/15
|
|
|
X
|
X
|
|
|
|
X
|
|
|
|
X
|
|
B2
|
*
|
Resist. to Solvents |
(Note #7)
|
0/3
|
0/3
|
0/3
|
X
|
|
|
|
|
|
|
X
|
X
|
|
|
X
|
|
B3
|
*
|
Solderability Test |
(Note #7)
|
0/3
|
0/3
|
0/3
|
X
|
X
|
|
X
|
|
|
|
|
X
|
|
|
X
|
|
B4
|
*
|
Die Shear |
(Note #7)
|
0/5
|
0/5
|
0/5
|
X
|
|
X
|
|
X
|
|
|
|
|
|
X
|
X
|
|
B5
|
*
|
Ball Shear/Bond Pull |
(Note #7)
|
0/5
|
0/5
|
0/5
|
X
|
|
|
X
|
|
X
|
X
|
X
|
|
|
X
|
X
|
|
B6
|
*
|
External Visual |
(Note #7)
|
0/25
|
0/25
|
0/25
|
X
|
X
|
X
|
X
|
|
|
|
X
|
|
|
|
X
|
|
B7
|
|
Internal Visual |
(Note #7)
|
0/5
|
0/5
|
0/5
|
X
|
X
|
X
|
X
|
X
|
X
|
X
|
|
|
X
|
X
|
X
|
|
B8
|
*
|
S.A.T./Dye Pen Test |
(Note #7)
|
0/5
|
0/5
|
0/5
|
X
|
X
|
X
|
X
|
|
|
|
X
|
X
|
|
|
X
|
|
B9
|
|
Auto Clave (SPP) (optional) 0/76 |
|
0/76
|
0/32
|
0/22
|
X
|
X
|
X
|
X
|
|
X
|
|
X
|
|
|
|
X
|
|
B10
|
**
|
X-Ray |
(Note #7)
|
0/5
|
0/5
|
0/5
|
X
|
X
|
X
|
|
|
X
|
X
|
X
|
|
|
|
X
|
|
B11
|
|
Flammability Test |
(Note #7)
|
Per lot
|
Per lot
|
Per lot
|
|
|
|
|
|
|
|
X
|
|
|
|
X
|
|
B12
|
*
|
Lead Material/Plating Thickness |
|
0/3
|
0/3
|
0/3
|
X
|
|
|
X
|
|
|
|
|
X
|
|
|
X
|
|
B13
|
|
Process Cross Section |
|
2
|
2
|
2
|
|
|
|
|
|
|
|
|
|
|
X
|
X
|
|
C1-A
|
|
High Temp Life Test |
|
0/76
|
0/32
|
0/22
|
|
|
|
|
|
|
|
|
|
X
|
X
|
X
|
|
C1-B
|
|
Low Temp Life Test |
(Note #7)
|
0/22
|
0/22
|
0/22
|
|
|
|
|
|
|
|
|
|
|
X
|
X
|
|
C2
|
|
C2-A: HAST (0/22) or C2-B: 85/85 |
|
0/76
|
0/32
|
0/22
|
X
|
|
X
|
X
|
X
|
X
|
|
X
|
|
|
X
|
X
|
|
C3
|
|
ESD (HBM) |
(Note #8)
|
0/3 (9)
|
0/3 (9)
|
0/3 (6)
|
|
|
|
|
|
|
|
|
|
X
|
|
X
|
|
C4
|
|
High Temp Storage (Optional) |
|
0/77
|
0/32
|
0/22
|
|
|
|
|
|
|
|
X
|
|
|
X
|
X
|
|
D1
|
*
|
Physical Dimension |
|
0/5
|
0/5
|
0/5
|
X
|
X
|
|
|
|
|
|
X
|
X
|
|
|
X
|
|
D2
|
*
|
Lead Integrity |
|
0/3
|
0/3
|
0/3
|
X
|
X
|
|
X
|
|
|
|
|
X
|
|
|
X
|
|
D7
|
*
|
Adhesion of Lead Finish (Optional) |
(Note #7)
|
0/3
|
0/3
|
0/3
|
X
|
|
|
X
|
|
|
|
|
X
|
|
|
X
|
|
D9
|
|
Temp Cycle |
|
0/76
|
0/32
|
0/22
|
X
|
X
|
X
|
X
|
X
|
X
|
X
|
X
|
|
|
X
|
X
|
|
D10
|
|
Thermal Shock (Optiona) |
|
0/76
|
0/32
|
0/22
|
|
|
|
|
|
|
|
|
|
|
|
X
|
|
E1
|
|
Electrical Test & Data Log |
|
0/30
|
0/20
|
0/10
|
|
|
|
|
|
|
|
|
|
X
|
X
|
X
|
|
E2
|
|
Electrical Characterization |
|
0/30
|
0/30
|
0/30
|
|
|
|
|
|
|
|
|
|
X
|
X
|
X
|
|
E3
|
|
T.D.D.B. |
(Note #7)
|
-
|
-
|
-
|
|
|
|
|
|
|
|
|
|
|
X
|
X
|
|
E4
|
|
Latch-Up |
|
0/10
|
0/10
|
0/4
|
|
|
|
|
|
|
|
|
|
X
|
|
X
|
|
E5
|
|
Electromigration |
(Note #7)
|
-
|
-
|
-
|
|
|
|
|
|
|
|
|
|
|
X
|
X
|
|
E6
|
|
Photosensitivity (Optional) |
|
0/11
|
0/11
|
0/11
|
|
|
|
|
|
|
|
|
|
X
|
X
|
X
|
|
E7
|
|
Data Retention Bake (EPLD & EPROM) |
|
0/45
|
0/22
|
0/15
|
|
|
|
|
|
|
|
|
|
X
|
X
|
X
|
|
E8
|
|
Input/Output Capacitance |
|
0/5
|
0/5
|
0/3
|
|
|
|
|
|
|
|
|
|
X
|
|
X
|
|
E9
|
|
Power Cycling |
|
0/76
|
0/32
|
0/22
|
|
|
|
|
|
|
|
|
|
X
|
X
|
X
|
| E10 |
|
CDM |
|
-
|
-
|
-
|
|
|
|
|
|
|
|
|
|
X (Note #10)
|
X
|
X
|
|
Qty required per lot
|
|
Electrically good
|
238/106/76
|
162/74/54
|
253/121/91
|
248/116/86
|
157/69/49
|
238/106/76
|
86/74/54
|
325
|
5
|
297/176/128
|
455/202/135
|
811/470/372
|
|
Electrical rejects
|
60
|
41
|
35
|
40
|
5
|
5
|
5
|
43
|
25
|
0
|
10
|
60
|
|
Total Units Required
|
298/166/136
|
203/115/95
|
288/156/126
|
288/115/95
|
162/74/54
|
243/111/81
|
91/79/59
|
368
|
30
|
297/176/128
|
465/212/145
|
871/530/432
|
|
1)
|
Refer to Table #2 for test method and stress
conditions. |
|
2)
|
Category 1 die size is <.571" x .643";
Category 2 die size is <.764" x .864"; Category 3 die size is >/=.764"
x .864". |
|
3)
|
Qualification of a new assembly plant or any
new package which has not been qualified in a qualified assembly facility. |
|
4)
|
Any new package where the same package body
size with different lead pitch has been qualified. |
|
5)
|
New leadframe design whereby the paddle size
is larger than the existing largest leadframe paddle size used in the same
qualified package. |
|
6)
|
For new mask from same device family, HTOL
may or may not be required; ESD, LATCH-UP, CAPACITANCE and CHARACTERIZATION
DATA are required. |
|
7)
|
In process monitor data may be used to satisfy
this requirement. |
|
8)
|
Acceptance criteria is 0/3, however 9 or 6
devices are required for ESD design characterization. |
|
*
|
Electrical rejects can be used as test sample. |
|
**
|
This is a non-destructive test; sample can
be re-used. |
| 9) |
A full qualification is for process, assembly
site and package. |
| 10) |
New device/new process - 1000 volt minimum. |
