|
TEST SEQ
|
TEST DESCRIPTION
|
ACC#/SAMPLE SIZE
PER DIE SIZE CATEGORY
(Note #2) |
NEW PKG FAMILY
|
NEW PKG QUALIFIED FAMILY
|
LEAD FRAME
|
DIE ATTACH
|
WIRE BOND
|
TYPE OF SEAL
|
LEAD FINISH
|
NEW CAVITY SIZE
|
NEW DEVICE
|
NEW FAB PROCESS
|
FULL QUAL
|
| |
|
(Note #1)
|
|
CAT.1
|
CAT.2
|
CAT.3
|
(Note #3)
|
(Note #4)
|
|
|
|
|
|
(Note #5)
|
(Note #6)
|
|
(Note #9)
|
|
B1
|
|
Solder Heat Test (Optional) |
|
0/15
|
0/15
|
0/15
|
X
|
X
|
|
|
|
X
|
|
X
|
|
|
X
|
|
B2
|
*
|
Resistance To Solvents |
(Note #7)
|
0/3
|
0/3
|
0/3
|
X
|
|
|
|
|
|
X
|
|
|
|
X
|
|
B3
|
*
|
Solderability Test |
(Note #7)
|
0/3
|
0/3
|
0/3
|
X
|
|
X
|
|
|
|
X
|
|
|
|
X
|
|
B4
|
*
|
Die Shear / Stud Pull |
(Note #7)
|
0/5
|
0/5
|
0/5
|
X
|
X
|
|
X
|
|
|
|
|
|
X
|
X
|
|
B5
|
*
|
Bond Pull |
(Note #7)
|
0/5
|
0/5
|
0/5
|
X
|
X
|
X
|
|
X
|
|
|
|
|
X
|
X
|
|
B6
|
*
|
External Visual |
(Note #7)
|
0/25
|
0/25
|
0/25
|
X
|
X
|
X
|
|
|
X
|
|
X
|
|
|
X
|
|
B7
|
|
Internal Visual |
(Note #7)
|
0/5
|
0/5
|
0/5
|
X
|
X
|
X
|
X
|
X
|
|
|
|
X
|
X
|
X
|
|
B12
|
*
|
Lead Material/Plating Thickness |
|
0/3
|
0/3
|
0/3
|
X
|
|
X
|
|
|
|
X
|
|
|
|
X
|
|
B13
|
|
Process Cross Section |
|
2
|
2
|
2
|
|
|
|
|
|
|
|
|
|
X
|
X
|
|
C1-A
|
|
High Temp Life Test |
|
0/76
|
0/32
|
0/22
|
|
|
|
|
|
|
|
|
X
|
X
|
X
|
|
C1-B
|
|
Low Temp Life Test |
(Note #7)
|
0/22
|
0/22
|
0/22
|
|
|
|
|
|
|
|
|
|
X
|
X
|
|
C3
|
|
ESD (HBM) |
(Note #8)
|
0/3 (9)
|
0/3 (9)
|
0/3 (6)
|
|
|
|
|
|
|
|
|
X
|
|
X
|
|
C4
|
|
High Temp Storage (Optional) |
|
0/77
|
0/32
|
0/22
|
|
|
|
|
|
|
|
|
|
X
|
X
|
|
D1
|
*
|
Physical Dimension |
|
0/5
|
0/5
|
0/5
|
X
|
X
|
|
|
|
|
X
|
X
|
|
|
X
|
|
D2
|
*
|
Lead Integrity |
|
0/3
|
0/3
|
0/3
|
X
|
X
|
X
|
|
|
|
X
|
|
|
|
X
|
|
D3
|
|
Thermal Shock + Temp Cycle + Moisture
Resistance |
0/15
|
0/15
|
0/15
|
X
|
X
|
X
|
X
|
X
|
X
|
X
|
X
|
|
|
X
|
|
D4
|
|
Mechanical Shock + Vibration +
Constant Acceleration |
0/15
|
0/15
|
0/15
|
X
|
X
|
X
|
X
|
X
|
X
|
|
X
|
|
|
X
|
|
D5
|
*
|
Salt Atmosphere |
|
0/15
|
0/15
|
0/15
|
X
|
X
|
X
|
|
|
|
X
|
|
|
|
X
|
|
D6
|
*
|
Internal Vapor Content |
(Note #7)
|
0/3
|
0/3
|
0/3
|
X
|
X
|
|
X
|
|
X
|
|
X
|
|
|
X
|
|
D7
|
*
|
Adhesion of Lead Finish (Optional) |
|
0/3
|
0/3
|
0/3
|
X
|
X
|
X
|
|
|
|
X
|
|
|
|
X
|
|
D8
|
*
|
Lid Torque |
|
0/5
|
0/5
|
0/5
|
X
|
X
|
|
|
|
X
|
|
X
|
|
|
X
|
|
D9
|
|
Temp Cycle |
|
0/76
|
0/32
|
0/22
|
X
|
X
|
|
X
|
X
|
X
|
|
X
|
X
|
X
|
X
|
|
E1
|
|
Electrical Test & Datalog |
|
0/30
|
0/20
|
0/10
|
|
|
|
|
|
|
|
|
X
|
X
|
X
|
|
E2
|
|
Electrical Characterization |
|
0/30
|
0/30
|
0/30
|
|
|
|
|
|
|
|
|
X
|
X
|
X
|
|
E3
|
|
T.D.D.B. |
(Note #7)
|
-
|
-
|
-
|
|
|
|
|
|
|
|
|
|
X
|
X
|
|
E4
|
|
Latch-Up |
|
0/10
|
0/10
|
0/4
|
|
|
|
|
|
|
|
|
X
|
|
X
|
|
E5
|
|
Electromigration |
(Note #7)
|
-
|
-
|
-
|
|
|
|
|
|
|
|
|
|
X
|
X
|
|
E6
|
|
Photosensitivity (Optional) |
|
0/11
|
0/11
|
0/11
|
|
|
|
|
|
|
|
|
X
|
X
|
X
|
|
E7
|
|
Data Retention Bake (EPLD & EPROM) |
|
0/45
|
0/22
|
0/15
|
|
|
|
|
|
|
|
|
X
|
X
|
X
|
|
E8
|
|
Input/Output Capacitance |
|
0/5
|
0/5
|
0/3
|
|
|
|
|
|
|
|
|
X
|
|
X
|
|
E9
|
|
Power Cycling |
|
0/76
|
0/32
|
0/22
|
|
|
|
|
|
|
|
|
X
|
X
|
X
|
| Qty
required per lot |
Electrically good
|
126/82/72
|
126/82/72
|
35
|
111/67/57
|
111/67/57
|
121/77/67
|
15
|
121/77/67
|
373/208/150
|
449/240/183
|
518/325/241
|
|
Electrical Rejects
|
81
|
69
|
57
|
8
|
5
|
33
|
35
|
38
|
0
|
10
|
78
|
|
Total Units Required
|
207/163/153
|
195/151/141
|
92
|
119/75/65
|
116/72/62
|
154/110/100
|
50
|
159/115/105
|
373/208/150
|
449/240/183
|
596/403/319
|
|
1)
|
Refer to Table #2 for test method and stress
conditions. |
|
2)
|
Category 1 die size is <.571" x .643";
Category 2 die size is <.764" x .864"; Category 3 die size is >/=.764"
x .864". Refer to Section 8.1. |
|
3)
|
Qualification of a new assembly plant, or,
any new package which has not been qualified in the qualified assembly
facility. |
|
4)
|
Package Type - A package with a unique case
outline, configuration, material, piece parts and assembly processes. |
|
5)
|
Applicable to new piece parts or leadframe
where the cavity size is larger than the largest cavity size for the same
package. |
|
6)
|
For new mask from same device family, HTOL
may or may not be required; ESD, LU, CAP and CHARDATA are required. |
|
7)
|
In process monitor data may be used to satisfy
this requirement; for Qual data, data from Assy lot traveller may be used. |
|
8)
|
Acceptance criteria is 0/3, however 9 devices
are required for ESD design characterization. |
|
9)
|
A full qualification is for process, assembly
site and package. |
|
*
|
Electrical rejects can be used as test sample. |
