|
TEST SEQ
|
TEST DESCRIPTION |
REFERENCE SPEC
Mil-Std-883 / JEDEC/STACK
|
XILINX
|
TEST OR STRESS CONDITIONS
|
PRODUCT MONITOR SAMPLE SIZES
|
PRODUCT MONITOR FREQUENCY
|
Notes (#1)
|
|
B
|
PACKAGE/PROCESS |
CAT.1
|
CAT.2
|
CAT.3
|
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|
B1
|
Solder Heat Test (Optional) |
JEDEC Mtd A112
|
D1005
RTP0024
|
Immersion in solder @ 260 °C for 12 sec
End-point electrical parameter @ 25 °C |
-
|
For Qualification only
|
|
|
B2
|
Resistance to Solvents |
Mil-Std-883 Mtd 2015
|
B1026
|
1 device per chemical for 1 minute, then brush
10 times |
0/3
|
In-line Process Monitor
|
|
|
B3
|
Solderability Test |
Mil-Std-883 Mtd 2003 STACK 0001 Test 5
|
B1023
RTP0024
|
8 hrs steam age: TH: 245 °C / 5 sec
SMC: 215 °C for 5 sec (wetting)
SMC: 260 °C for 10 sec (dewetting) |
0/22
(3 units)
|
In-line Process Monitor
|
#2, #11
|
|
B4
|
Die Shear / Stud Pull |
Mil-Std-883 Mtd 2019
|
N/A
|
Die Shear strength > 5.0 kg |
0/5
|
In-line Process Monitor
|
#11
|
|
B5
|
Bond Pull |
Mil-Std-883 Mtd 2011
|
N/A
|
Bond Pull strength > 2 gm |
0/15
(4 units)
|
In-line Process Monitor
|
#6, #11
|
|
B6
|
External Visual |
Mil-Std-883 Mtd 2009
|
N/A
|
Package defects, Lead defects |
0/25
|
In-line Process Monitor
|
#11
|
|
B7
|
Internal Visual |
Mil-Std-883 Mtd 2010
|
N/A
|
Die defects, die-attach defects and wirebond
defects |
0/5
|
In-line Process Monitor
|
#11
|
|
B12
|
Lead Material/Plating
Thickness (Optional) |
|
|
|
-
|
|
|
|
B13
|
Process Cross-Section |
|
|
Cross-Section shall be performed by the fabrication
facility or by the Xilinx Process Technology Department. For Qualification:
all layers are shown with measurements. For Monitors: vias, contacts
and metal step coverage measurements are required. |
-
|
|
|
|
C
|
MICRO CIRCUIT
FAMILY |
|
C1-A
|
High Temp Life Test |
Mil-Std-883 Mtd 1005
|
RTP0003
|
125 °C / 168, 500 and 1000 hrs or equivalent
End-point electrical test @ 25 °C, verify device
parameter drift (<10%) |
LTPD 5 0/45
|
LTPD 7 0/32
|
LTPD 10 0/22
|
1x / 6 months
|
#3, #4,
#5, #8
|
|
C1-B
|
Low Temp Life Test |
Mil-Std-883 Mtd 1005
|
N/A
|
< -10 ° C/1000 hrs
End-point electrical test @ 25 °C, verify device
parameter drift (<10%) |
-
|
In-line Process Monitor
|
#11
|
|
C3
|
ESD (HBM) |
Mil-Std-883 Mtd 3015
|
TSP0001
RTP0032
|
3 positive and 3 negative pulses, all pins
tested, 2000 volts min. |
-
|
For Qualification only
|
|
|
C4
|
High Temp Storage
(Optional) |
Mil-Std-883 Mtd 1008
|
RTP0028
|
150 °C / 500, 1000 hrs
End-point electrical test @ 25 °C |
-
|
For Qualification only
|
|
|
D
|
PACKAGE DESIGN |
|
D1
|
Physical Dimension |
Mil-Std-883 Mtd 2016
|
B1027
|
Per applicable package outline drawing
|
0/5
|
1x / 6 months
|
#2, #8
|
|
D2
|
Lead Integrity
Seal (Fine/Gross) |
Mil-Std-883 Mtd 2004
Mil-Std-883 Mtd 2028
Mil-Std-883 Mtd 1014
|
B1063/62
B1064
B1024
|
Condition B2 (Use Condition B1 for leaded
chip carrier pkgs
Condition A, Tracer gas (He) fine leak &
Condition C, Perfluorocarbon gross leak |
0/45
(3 units)
|
1x / 6 months
|
#2, #6,
#7, #8
|
|
D3
|
Thermal Shock +
Temp Cycle + Moisture Resistance Seal
(Fine/Gross) |
Mil-Std-883 Mtd 1011
Mil-Std-883 Mtd 1010
Mil-Std-883 Mtd 1004
Mil-Std-883 Mtd 1014
|
B1001
B1002
B1049
B1005
|
Condition C, -65/150 °C (Liquid to Liquid),
15 cycles
Condition C, -65/150 °C (Air to Air), 100 cycles
90% RH/ -10/25/65 °C, 10 cycles
Condition A, Tracer gas (He) fine leak &
Condition C, Perfluorocarbon gross leak |
0/15
|
1x / 6 months
|
#2, #8,
#9
|
| |
Visual Examination |
Mil-Std-883 Mtd 1011 & Mtd 1004
|
B1006
B1007
|
Per visual criteria in Method 1011 and Method
1004
End-point electrical Test @ 25 °C |
|
|
|
|
D4
|
Mechanical Shock +
Variable Frequency Vibration + Constant Acceleration
Seal (Fine/Gross) |
Mil-Std-883 Mtd 2002
Mil-Std-883 Mtd 2007
Mil-Std-883 Mtd 2001
Mil-Std-883 Mtd 1014
|
B1083
B1076
B1008
B1005
|
Condition B, 1500 G Peak, 0.5 msec pulse duration
Condition A, at peak acceleration of 20 g
Condition E - For Pkg < 5 gms or inner sealed cavity
< 2 inches
Condition D - For Pkg >= 5 gms or inner sealed cavity
>= 2 inches
Condition A, Tracer gas (He) fine leak & |
0/15
|
1x / 6 months
|
#2, #8
|
| |
Visual Examination |
Mil-Std-883 Mtd 1011 & Mtd 1004
|
B1006
B1007
|
Condition C, Perfluorocarbon gross leak
Per visual criteria in Method 1011 and Method 1004
End-point electrical test @ 25 °C |
|
|
|
|
D5
|
Salt Atmosphere
Visual Examination
Seal (Fine/Gross) |
Mil-Std-883 Mtd 1009
Mil-Std-883 Mtd 1009
Mil-Std 883 Mtd 1014
|
B1050
B1027
B1005
B1006
|
Condition A, soak time = 24 hrs
Per visual criteria in method 1009
Condition A, Tracer gas (He) fine leak &
Condition C, Perfluorocarbon gross leak |
-
|
For Qualification only
|
|
|
D6
|
Internal Vapor Content |
Mil-Std-883 Mtd 1018
|
B1010
|
5000 ppm max. at 100 °C |
0/3
|
1x / 6 months
|
#2, #8,
#11
|
|
D7
|
Adhesion of Lead Finish
(Optional) |
Mil-Std-883 Mtd 2025
|
B1018
|
Bend Coated lead at an angle of 90° until
fracture occurs.
No flaking, peeling or detachment of coating at the interface. |
-
|
For Qualification only
|
|
|
D8
|
Lid Torque |
Mil-Std-883 Mtd 2024
|
B1048
|
Applicable to Glass Frit Sealed Package only
The Torque value must meet the minimum limits as specified
in
Table #1 of the Mil-Std-883 Method 2024.2 |
0/5
|
1x / 6 months
|
#2, #8
|
|
D9
|
Temp Cycle
Seal (Fine/Gross) |
Mil-Std-883 Mtd 1010
Mil-Std-883 Mtd 1014
|
B1002
B1005
B1006
|
Condition C -65/150 °C, 500 cycles
Condition A, Tracer gas (he) fine leak &
Condition C, Perfluorocarbon gross leak
End-point electrical test @ 25 °C |
LTPD 5 0/45
|
LTPD 7 0/32
|
LTPD 10 0/22
|
1x / 6 months
|
#2, #5
|
|
E
|
ELECTRICAL
ENDURANCE/EVALUATION & PROCESS VALIDATION DATA |
|
E1
|
Electrical Test
& Datalog |
STACK 0001, Test 1c
|
|
@ 25 °C, Top min. & Top max. |
-
|
New Prod. Characterization
|
|
|
E2
|
Electrical
Characterization |
STACK 0001, Test 1d
|
|
Schmoo plot & Temperature trends for critical
parameters |
-
|
New Prod. Characterization
|
|
|
E3
|
T.D.D.B. |
STACK 0001, Test 38
|
|
Characterization of oxide integrity |
-
|
In-line Process Monitor
|
#10, #11
|
|
E4
|
Latch-Up |
JEDEC-STD-17
|
TSP0006
|
a) Immunity to PSOV of 20% over absolute Maximum
voltage
b) Immunity to +/-200mA current injection into I/O pins |
-
|
New Prod. Characterization
|
|
|
E5
|
Electromigration |
STACK 0001, Test 39
|
|
Characterization of Metallisation system
> 100,000 hours for 0.1% cumulative failures
> 100,000 hours for 50% cumulative failures |
-
|
In-line Process Monitor
|
#11
|
|
E6
|
Photosensitivity
(Optional) |
STACK 0001, Test 37
|
|
Apply 25W neon bulb, distance = 50 cm during
electrical test. |
|
New Prod. Characterization
|
|
|
E7
|
Data Retention Bake |
Mil-Std-883 Mtd 1033
|
RTP0028
|
Write device with suitable pattern, bake @
150 °C for 1000 hrs
Read and confirm data pattern
End-point electrical test @ 25 °C |
-
|
New Prod. Characterization
|
#12
|
|
E8
|
Input/Output
Capacitance |
Mil-Std-883 Mtd 3012
|
RTP0031
|
Biased @ nominal operating voltage |
-
|
New Prod. Characterization
|
|
|
E9
|
Power Cycling |
|
RTP0029
|
5000 cycles @ 50 °C with Vcc = 5.0V
Vpp = 12 to 12.5 V |
-
|
New Product Characterization
|
|
|
1)
|
For any Qualification or Product Monitor where
sample size does not meet the Standard Quality level, approval from Product
Engineering and Product QA is required. |
| 2) |
The Product Monitor Frequency applies to each
package family with assembly locations and package type rotated each Quarter
(when applicable). If only one package type exists within a package family,
the product monitor frequency will be 1x / 12 months, minimum. |
| 3) |
The Product Monitor Frequency applies to each
Micro Circuit Family. Plastic monitor data may be used to satisfy this
requirement. |
| 4) |
End-point electrical test shall be performed
within 48 hrs window. |
| 5) |
Interim read point is optional. |
| 6) |
The sample size is for numbers of bonds or
numbers of leads. |
| 7) |
For LCC packages, use LTPD 15, 15 (0,1). |
| 8) |
Military QCI monitor data may be used to satisfy
this requirement. |
| 9) |
End-point electrical test @ 25 °C shall
be performed within 48 hrs after moisture resistance test. |
| 10) |
T.D.D.B. - Time Dependent Dielectric Breakdown |
| 11) |
In process monitor data may be used to satisfy
the Qualification requirement; refer to Assembly Qualification lot traveller
or Fab monitor data. |
| 12) |
Not applicable to FPGA's; H.T.O.L. test data
@ 150 +0/-5 °C may be used to satisfy this requirement. |
