Answers Database
PACKAGING: PLCC Chips fail on multichip board--swapped in chips function ok.
Record #156
Problem Title:
PACKAGING: PLCC Chips fail on multichip board--swapped in chips function ok.
Problem Description:
Plastic package chips are sensitive to moisture. Chips may be ordered as
"baked", or users should bake the devices themselves to remove any residual
moisture. If this is not done, some board assembly instertion methods may
damage the chip.
Solution 1:
End of Record #156 - Last Modified: 11/06/96 03:10 |
