Answers Database
Can Xilinx Devices be wave soldered or immersed in solder?
Record #1347
Problem Title:
Can Xilinx Devices be wave soldered or immersed in solder?
Problem Description:
Can Xilinx Devices be wave soldered or immersed in solder?
What are the guidelines if the device is to be wave soldered?
Solution 1:
Since most of Xilinx device packages are manufactured out of plastic, it is not suggested to wave so
lder or immerse the device in solder.
If the device is to be wave soldered, special care must be made to ensure that the maximum temperatu
re of the package body does not exceed 220 degrees C and that all of the components are kept in a dr
y condition. Unless specifically stated for any package type, dry condition implies less than 0.12%
of moisture by package weight.
Refer to pages 11-18 to 11-20 of the 1996 Xilinx Programmable Logic Data Book for more information o
n handling components that are moisture sensitive.
End of Record #1347 - Last Modified: 10/29/96 13:40 |
