October 5, 2000
Attention Valued Customer,
Subject: Minor modification in the package outline specification
of thermally enhanced BG and FG series packages meeting the JEDEC-MO-191.
Affected Package codes
BG352 - Xilinx reference OBG0008
BG432 - Xilinx reference OBG0009
BG560 - Xilinx reference OBG0010
FG680 - Xilinx reference OBG0022
Change description: Xilinx is modifying the specification
that controls the mechanical dimensions of the copper heatsink on these
BGA packages. The current specification
implied a heatsink that is coincident with the package body. The proposed
modification will allow the heatsink to be pulled back from the edge by
a maximum of 0.375mm (14.7mils) per side. The current products will meet
the change since their heatsink is coincident (0.0 pull back) with the
package.
The attached outline drawings show the change in the actual package
outlines. No other change is made in the package outline specification.
There is no functional change in product performance or characteristics.
Reason for Change: This minor physical change in heatsink
specification will allow Xilinx to consider pieceparts from other sources.
The new specification will allow alternate sources to meet the outline
drawing, and more importantly to support the anticipated growing needs
of the enhanced BGA packages.
Key Dates: The specification change is immediate. Products
with coincident heatsinks will continue to ship and these will continue
to meet the specification. Qualification test of product with pull
back heatsinks will be completed prior to shipment of product. This
data will be available upon request via email at pcn@xilinx.com.
Xilinx plans to ship product with pull back heatsinks meeting the new
specification during January, 2001.
Traceability: Products built with non-coincident heatsink
can be recognized by sight. We consider the physical change to be minor
with no functional changes in product performance or characteristics.
Response: No response to this notification is required.
Please address any other questions you may have via e-mail at pcn@xilinx.com,
or directly by fax at (408) 369-1718. |