December 29, 2000
Attention Valued Customer,
Subject: Additional equivalent wafer foundries for
fabrication of Virtex™ commercial (C-grade and I-grade) product
family.
Products Affected: The following commercial (C-grade and
I-grade) members of Virtex product line are affected: XCV300, XCV400, XCV600,
XCV800 and XCV1000. Note that this notice does not affect any Virtex-E™
devices.
Change Description: The Virtex product family is currently
manufactured using 0.22µ 5 layer metal process. A new 0.22µ
/ 0.18µ 6 layer metal process at additional equivalent foundries
will be used to manufacture the Virtex product family. Virtex products
produced from the 0.22µ / 0.18µ process will be performance,
form, fit and functionally equivalent to the current product.
Reason for Change: This change is being made to establish
additional sources for the Virtex product family to ensure continuity of
supply. Qualification
data on Virtex (0.22µ and 0.18µ) product is attached.
Key Dates: Xilinx will begin shipping Virtex products
fabricated with the 0.22µ / 0.18µ process on the following
schedule:
Device: |
Sample Devices Available From: |
Production Devices Available From: |
XCV1000 |
Early December 2000 |
Mid March 2001 |
XCV800 |
Early February 2001 |
Mid April 2001 |
XCV600 |
Mid March 2001 |
Late May 2001 |
XCV400 |
Late March 2001 |
Early June 2001 |
XCV300 |
Late March 2001 |
Early June 2001 |
Each additional equivalent foundry will be assigned a unique identifier.
Advisory notification will be sent within 30 days prior to sample shipments.
Response: No response to this notification is required.
Requests for additional data or support should be made within 90 days of
notification. Please address any questions you may have via email at pcn@xilinx.com,
or directly by fax at 408 369 1718. |