| 10 August 1998;
Attention: Valued Customer,
Subject: Process Change Notification (PCN98007) - A change
in the mold compound and die attach epoxy used to fabricate Xilinx PLCC
and QFP packages (excluding VQFP and TQFP packages)
Products Affected: All Xilinx PLCC and QFP packages assembled
at AMKOR and SPIL.
Change Description: The mold compound and die attach epoxy used
to fabricate Xilinx plastic packaged products at AMKOR (including Korea
and Philippines) and SPIL (Taiwan) assembly sites are being changed. Currently
PLCC packages are fabricated with Sumitomo 6300H while QFP packages are
fabricated with Sumitomo 7304LC. In both cases, the current die attach
epoxy is Ablestik 84-1LMIS. After the date indicated below (date code 9845),
PLCC and QFP packages will all be molded with Nitto MP8000 mold compound,
and die attach will be done with Ablestik 8361J. Qualification
data is attached.
Reason for Change: Xilinx is transitioning to more modern mold
compound and die attach epoxy to improve the package integrity and reliability
of our products. Once the transition is complete, Xilinx will announce
significant improvements in moisture resistance and shelf life (as measured
by J-STD 20).
Key Dates: Product molded after assembly date code 9845 (product
molded after 15 November 1998) will use the new materials.
Traceability: Traceability is by date code (see above)
Immediate response to this notification is not required. For any questions
regarding this PCN you may contact Xilinx at "pcn@xilinx.com",
or by FAX at 408 559 1368.
Sincerely yours,
Joseph J Fabula
Director Q/A
|
