| Customer Update XCU2000-03
Addition of PPT as a Substrate Supplier
November 14, 2000,
Subject: Addition of PPT
(Phoenix Precision Technology Corporation) as a substrate supplier
for all thermally enhanced BGA packages.
Products Affected: All packages with the following package
codes BG352, BG432, BG560 and FG680.
Change Description: PPT (Phoenix Precision Technology
Corporation) based in Taiwan has been added as a qualified substrate
supplier for Xilinx thermally enhanced BGA packages.
Qualification Data:
| Lot # |
Device |
Package |
Reliability Tests |
Quantity |
Hours/Cycles |
Fails |
| X7419R |
XCV1000 |
BG560 |
85°C/85% RH |
32 pcs |
1000 |
0 |
| X7421R |
XCV1000 |
BG560 |
Temp Cycle |
32 pcs |
1000 |
0 |
| X7422R |
XCV1000 |
BG560 |
Pressure Pot |
32 pcs |
96 |
0 |
Note: Qualification of the BG560 package also qualifies the BG352, BG432,
and FG680 packages.
Reason For Change: This addition is being made to meet
the anticipated growth of the enhanced BGA packages. It is also part of
our continuous effort towards improving total customer satisfaction.
Key Dates: Products will be assembled with PPT as a substrate
supplier starting with date code 0045.
Traceability: There will be no distinguishing external
device markings. Actual product marking will not change and product will
continue to be assembled by our qualified suppliers in Korea, Philippines
and Taiwan. The reliability and assembly performance of these substrates
is equivalent to the existing substrates from the other qualified vendors.
Response: No response to this notification is required.
Please address any other questions you may have via e-mail at pcn@xilinx.com,
or directly by fax at (408) 369-1718. |
