Home : Products : Devices : Virtex-II Pro Platform FPGAs : Virtex-II Pro Data Sheet  Virtex-II Pro™ Platform FPGA Data Sheet  (DS083)  (2.2 MB) All 4 Modules  (01/20/03)
What's New Success Stories		Module 1:  (120 KB) Introduction and Overview v2.4  (01/20/03)  Summary of Features  General Description  Architecture  IP Core and Reference Support  Device/Package Combinations and Maximum I/O  Ordering Information Module 2:  (550 KB) Functional Description v2.5   (01/20/03) Functional Description: Rocket I/OTM Multi-Gigabit Transceiver  Functional Description: Processor Block  Functional Description: PowerPCTM 405 Core  Functional Description: FPGA  Input/Output Blocks (IOBs)  Digitally Controlled Impedance (DCI)  Configurable Logic Blocks (CLBs)  3-State Buffers  CLB/Slice Configurations  18-Kb Block SelectRAM Resources  18-Bit x 18-Bit Multipliers  Global Clock Multiplexer Buffers  Digital Clock Manager (DCM)  Routing  Configuration  Module 3:  (300 KB) DC and Switching Characteristics v2.6  (01/20/03)  Electrical Characteristics  Performance Characteristics  Switching Characteristics   Pin-to-Pin Output Parameter Guidelines  Pin-to-Pin Input Parameter Guidelines  DCM Timing Parameters Module 4:  (1.31 MB) Pinout Tables v2.5  (01/20/03) Pin Definitions  Pinout Tables  FG256 Wire-Bond Fine-Pitch BGA Package  FG456 Wire-Bond Fine-Pitch BGA Package  FG676 Wire-Bond Fine-Pitch BGA Package  FF672 Flip-Chip Fine-Pitch BGA Package  FF896 Flip-Chip Fine-Pitch BGA Package  FF1148 Flip-Chip Fine-Pitch BGA Package  FF1152 Flip-Chip Fine-Pitch BGA Package  FF1517 Flip-Chip Fine-Pitch BGA Package FF1696 Flip-Chip Fine-Pitch BGA Package  FF1704 Flip-Chip Fine-Pitch BGA Package		Xilinx Data Book Virtex-II Pro Product Information Virtex-II Pro User Guide Virtex-II Pro Package Files