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| Number | Description | Effective Date |
| PCN99008 | A change to the Icc Standby Specification of XC1702L and XC1704L Products (all Packages) | October 1, 1999 |
| PDN99007A | Addendum to PDN99007 to pull in the Last Time Buy and Last Time Ship dates for certain parts that use the PP132 and PP175 packages. | January 30, 2000 |
| PDN99007 | Withdrawal of certain commercial low volume device/package combinations. All speed grades and all temperature grades are affected. Note, however, that no Xilinx Military product offerings are affected. | October 15, 1999 |
| PDN99005 | Discontinuance of Certain Technology (0.8uM 10% shrink CMOS) Versions of the XC3000, XC3000A and XC3100A Product Families. | July 15, 1999 |
| PDN99004 | Discontinuance of Die and Wafer Sales for all Xilinx Product Families. | July 1, 1999 |
| PDN99003 | Discontinuation of certain members of the XC4000 Commercial and Industrial Product Line. | April 19, 1999 |
| PCN99002 | A change in the wafer fabrication process used to fabricate the XC4000XL commercial (C-grade and I-grade) product family. Note that this notice does not affect any SMD (Standard Military Drawing) devices. | May 24, 1999 |
| PDN99001 | Discontinuation of certain speed grades of the XC3000 and XC4000 SMD (Standard Military Drawing) and Commercial (M-grade) Products. | January 15, 1999 |