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| Number | Description | Effective Date |
| PCN97009A | A reissue of a minor enhancement to the Xilinx line of thermally enhanced quad flatpack (HQFP) packages. | Oct 29, 1997 |
| PDN97008A | An update of PDN97008. New Last Time Buy and Last Time Delivery dates. | Apr 15, 1998 |
| PDN97008 | Discontinuance of the XC7000 Product Families (including XC7200 and XC7300). | Aug 01, 1997 |
| PCN97007 | Conversion of Xilinx MIL-STD-883 Military Products to QML. | Apr 15, 1997 |
| PDN97006 | Withdrawal of certain specific low volume device/package combinations. Note that no Xilinx military offerings are affected. (See also XCU019701). | Jan 30, 1997 |
| PDN97005 | Withdrawal of certain specific low volume device/package combinations. Note that no Xilinx military offerings are affected. (See also XCU019701). | Jan 30, 1997 |
| PDN97004 | Withdrawal of Commercial and Industrial XC3100A -5 Speed Grades, all packages (note: Xilinx Military Products are not affected). (See also XCU019702). | Jan 30, 1997 |
| PDN97003 | Withdrawal of Commercial and Industrial XC3000 -70 Speed Grades, all packages (note: Xilinx Military Products are not affected). (See also XCU019702). | Jan 30, 1997 |
| PCN97002 | Additional Product Assembly Qualification of A.S.E. Taiwan. | Feb 15, 1997 |
| PCN97001 | Qualification of ASTRA Microtronics Technology in Batam, Indonesia as an assembly site for Xilinx PLCC packages. | Feb 28, 1997 |