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| Technology: | Si Gate CMOS |
| Device Type: | XC4025 |
| Package Type: | HQ240 Thermally Enhanced PQFP |
| Molding Compound: | Sumitomo 7304LC/F |
| Pre. Cond. 0.0802% |
Pressure Pot | Temp. Cycle | |
| 30/60% 192 Hrs. 3 V.P. 219°C |
192 Hrs. 121°C/2 Atm. |
510 Cycs. -65°C / +150°C |
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| Combined Started Lot: | 1 | 1 | 1 |
| Combined Completed Lots: | 1 | 1 | 1 |
| Failures: | 0 | 0 | 0 |
| Device on Test: | 136 | 44 | 78 |
| Actual Device Hours / Cycles: | 26,112 | 8,448 | 39,780 |
| Mean: | 192 | 192 | 510 |
| Bond Pull: | Passed | ||
| Die Shear: | Passed |