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Table 2A

Plastic Package / Product Monitor Requirements and Test Conditions

TEST SEQ
 TEST DESCRIPTION
REFERENCE SPEC Mil-Std-883 / JEDEC/STACK
XILINX
TEST OR STRESS CONDITIONS
PRODUCT MONITOR SAMPLE SIZES
PRODUCT MONITOR FREQUENCY
Notes (#1)
B
 PACKAGE/PROCESS
CAT.1 
CAT.2
CAT.3 
  
B1
 Solder Heat Test
(Optional)
JEDEC Std-22 Mtd A112
B1005
RTP0024
 Immersion in solder @ 260 °C for 12 sec 
End-point electrical test @ 25 °C
-
For Qualification only
#4
B2
 Resistance to Solvents
Mil-Std-883 Mtd 2015
B1026
 1 device per chemical for 1 minute, then brush 10 times
0/3
In-line Process Monitor
+ 1x / 3 months
#2, #16
B3
 Solderability Test
Mil-Std-883 Mtd 2003 STACK 0001 Test 5
B1023
RTP0024
 8 hrs steam age: PTH: 245 °C / 5 sec
PSMC: 215 °C for 5 sec (wetting) 
PSMC: 260 °C for 10 sec (dewetting)
0/22
(3 units)
In-line Process Monitor
+ 1x / 3 months
#2, #13,
#14, #16
B4
 Die Shear
Mil-Std-883 Mtd 2019
   Die Shear strength > 5.0 kg
0/5
In-line Process Monitor
#16
B5
 Ball Shear and
Bond Pull
STACK 0001 Test 6
B1004
 Ball shear strength > 50 gm 
Bond pull strength > 5.0 gm
0/10 (2 units)
0/8 (2 units)
In-line Process Monitor
#16
B6
 External Visual
Mil-Std-883 Mtd 2009
   Package defects, Lead defects
0/25
In-line Process Monitor
#16
B7
 Internal Visual
Mil-Std-883 Mtd 2010
   Die defects, die-attach and wirebond defects
0/5
In-line Process Monitor
#16
B8
 S.A.T. and Dye Pen.
Test
-
   Scanning Acoustic Tomograpy 
60 psig / 2 hrs. Dye Pen. < 10 mils from lead tip
0/5
For Qualification and Monitor
#11, #16
B9
 Auto Clave (SPP)
JEDEC Std-22 Mtd A102
RTP0002
 Preconditioning flow #1 or #2 (for PSMC only) 
96 hrs @ 2 ATM with saturated steam @ 121 °C 
End-point electrical parameter @ 25 °C
LTPD 5 0/45
LTPD 7 0/32
LTPD 10 0/22
1x / 3 months
#2, #6,
#14
B10
 X-Ray
-
   Wire sweep, Package void and Epoxy void 
0/5
In-line Process Monitor
#16
B11
 Flammability
UL-94 V0
   Bulk material in C of C per material shipment
-
  
#16
B12
 Lead Material/Plating Thickness
(Optional)		      
-
    
B13
 Process
Cross-Section		     Cross Section shall be performed by the fabrication facility or by the Xilinx Process Technology Department. For Qualification: all layers are shown with measurements. For Monitors: vias, contacts and metal step coverage measurements are required.
-
    
C
 MICRO CIRCUIT FAMILY
C1-A
 High Temp Life Test
Mil-Std-883 Mtd 1005
RTP0003
 145 ° C/256/500 and 1000 hrs or equivalent 
End-point electrical test @ 25 °C, verify device parameter drift (<10%)
LTPD 5 0/45
LTPD 7 0/32
LTPD 10 0/22
1x / 3 months
#3, #6,
#12
C1-B
 Low Temp Life Test
Mil-Std-883 Mtd 1005
   < -10 ° C/1000 hrs 
End-point electrical test @ 25 °C, verify device parameter drift (<10%)
-
For Qualification only
#16
C2-A
 85 °C/ 85% RH
JEDEC Std-22 Mtd A101
RTP0006
 Preconditioning flow #1 or #2 (for PSMC only) 
End-point electrical test @ 25 °C (for PSMC only) 
85 ° C / 85% RH static bias for 168, 500, 1000 hrs 
End-point electrical test @ 25 °C
LTPD 5 0/45
LTPD 7 0/32
LTPD 10 0/22
1x / 3 months
#2, #5,
#8, #12,
#14
C2-B
 HAST
JEDEC Std-22 Mtd 110
RTP0011
 Preconditioning flow #1 or #2 (for PSMC only) 
End-point electrical test @ 25 °C (for PSMC only) 
HAST -130 °C / 85% RH static bias for 50, 100 hrs 
End-point electrical test @ 25 °C
LTPD 10 0/22
LTPD 15 0/15
LTPD 20 0/11
1x / 3 months
#2, #5,
#9, #14
C3
 ESD (HBM)
Mil-Std-883 Mtd 3015
TSP0001
RTP0032
 3 positive and 3 negative pulses, all pins tested, 2000 volt minimum
-
For Qualification only
  
C4
 High Temp Storage (Optional)
Mil-Std-883 Mtd 1008
RTP0028
 150 °C/500, 1000 hrs 
End-point electrical test @ 25 °C
-
For Qualification only
#12
D
 PACKAGE DESIGN
CAT.1 
CAT.2
CAT.3 
  
D1
 Physical Dimension
Mil-Std-883 Mtd 2016
B1027
 Per applicable pkg outline drawing
0/5
1x / 3 months
#2
D2
 Lead Integrity
Mil-Std-883 Mtd 2004
B1024
 Condition B2
0/15 (3 units)
1x / 3 months
#2
D5
 Salt Atmosphere
Visual Examination
Seal (Fine/Gross)		 Mil-Std-883 Mtd 1009
Mil-Std-883 Mtd 1009
Mil-Std-883 Mtd 1014
B1050
B1027
B1005
B1006
 Cond A, soak time = 24 hrs
Per visual criterial in Method 1009
Condition A, Tracer gas (He) fine leak & Condition C, Perfluorocarbon gross leak
0/15 for N-grade monitoring only
    
D7
 Adhesion of
Lead Finish
(Optional)
Mil-Std-883 Mtd 2025
B1018
 Bend coated lead at an angle of 90 ° until fracture occurs. 
No flaking, peeling or detachment of coating at the interface.
-
For Qualification only
  
D9
 Temp Cycle
Mil-Std-883 Mtd 1010
PSP822
RTP0022
 Preconditioning flow #1 or #2 (for PSMC only) 
End-point electrical test @ 25 °C (for PSMC only) 
Condition C -65/150 °C, 500 cycles 
End-point electrical test @ 25 °C
LTPD 5 0/45
LTPD 7 0/32
LTPD 10 0/22
1x / 3 months
#2, #7
#14
D10
 Thermal Shock
Mil-Std-883 Mtd 1011
RTP0001
 Condition C, -65/150 °C, 100 cycles 
End-point electrical test @ 25 °C
LTPD 5 0/45
LTPD 7 0/32
LTPD 10 0/22
1x / 3 months
#2, #7
E
 ELECTRICAL ENDURANCE / EVALUATION AND PROCESS VALIDATION
E1
 Electrical Test 
& Datalog
STACK 0001, Test 1c
   @ 25 °C, minimum and maximum operating temp
0/10
New Product Characterization
  
E2
 Electrical
Characterization
STACK 0001, Test 1d
TSP0003
 Shmoo plot and temp trend for critical parameters
-
New Product Characterization
  
E3
 T.D.D.B.
STACK 0001, Test 38
   Characterization of oxide integrity  
In-line Process Monitor
#10, #16
E4
 Latch-Up
Jedec STD 17
TSP0006
 a) Immunity to PSOV of 20% over absolute Maximum voltage 
b) Immunity to +/-200mA current injection into I/O pins		  
New Product Characterization
  
E5
 Electromigration
STACK 0001, Test 39
   Characterization of Metallisation system
> 100,000 hours for 0.1% cumulative failures
> 100,000 hours for 50% cumulative failures		  
In-line Process Monitor
#16
E6
 Photosensitivity
(Optional)
STACK 0001, Test 37
   Apply 25W neon bulb, distance = 50 cm during electrical test  
New Product Characterization
  
E7
 Data Retention Bake
Mil-Std-883 Mtd 1033
RTP0028
 Write device with suitable pattern, bake @ 150 °C for 1000 hrs 
Read and confirm data pattern 
End-point electrical test @ 25 °C
-
New Product Characterization
#15
E8
 Input/Output 
Capacitance
Mil-Std-883 Mtd 3012
RTP0031
 Device shall be biased @ nominal operating voltage
-
New Product Characterization
  
E9
 Power Cycling  
RTP0029
 5000 cycles @ 50 °C with Vcc = 5.0V 
Vpp = 12 to 12.5 V
-
New Product Characterization
  

Notes:
1)
 For any Qual or Product Monitor where sample size does not meet the Standard Quality level, approval from Product Engineering and Product QA is required.
2) The Product Monitor Frequency applies to each package family with assembly locations and package type rotated each Quarter (when applicable).
3) The Product Monitor Frequency applies to each Micro Circuit Family, each Quarter.
4) For Moisture sensitive PSMC, a bake @ 125 °C for 16 hrs prior to solder heat test is required.
5) End-point electrical test shall be performed within 48 hrs window.
6) End-point electrical test shall be performed within 96 hrs window.
7) For Plastic encapsulated laminated PCB package, use condition B, -55 / 125 °C.
8) 85/85 Test is not required if HAST test is used.
9) HAST Test data is for information and not required for qualification.
10) T.D.D.B. - Time Dependent Dielectric Breakdown.
11) Dye Penetration test will be used as verification after S.A.T.
12) Interim read point is optional.
13) PTH - Plastic Through Hole.
14) PSMC - Plastic Surface Mount Component.
15) Not applicable to FPGA's; H.T.O.L. test data @ 150 +0/-5 °C may be used to satisfy this requirement.
16) In process monitor data may be used to satisfy this qual requirement, refer to assembly lot traveller or FAB/Assembly/Vendor monitor data.