Application Notes  Application Briefs  Data Book

Xcell Articles  Other Links

Application Notes

Title	Size
Common XC4000/XC5200 PC84 Footprint	50 KB
XC4010/XC4013 BG225 Pinout (Bottom View)	50 KB
XAPP074: Pin Preassigning with XC9500 CPLDs	50 KB

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Application Briefs

Title	Size
XBRF002: Low Power Benefits of XC4000E/X: Overview	30 KB

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Data Book

Title	Size
Packages and Thermal Characteristics	280 KB
Individual Package Drawings

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Xcell Articles

Title	Issue
Advanced Chip Scale & BGA Packaging	Q3 '99
New Chip Scale Packaging for Small, Lightweight Designs	Q4 '98
Chip-Scale Packaging: Ideally Suited to Today's Portable and Small Form-Factor Applications	Q3 '98
FPGAs, Power, and Packages	Q2 '97
Power, Package, and Performance: Trading Off Among the Three P's	Q3 '96

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Other Links

• Chip Scale Packaging
• Xilinx Announces Most Advanced Chip Scale Packaging
• Adapter and Socket Manufacturers
• Quality and Reliability
• Product Change Notifications
• Package File Updates for the Development System
• Xilinx Fine-Pitch BGA and CSP Packages
• Board Routability Guidelines with Xilinx Fine-Pitch BGA Packages
• Virtex Package Compatability Guide