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| Number | Description | Effective Date |
| PCN98007 | A change in the mold compound and die attach epoxy used to fabricate Xilinx PLCC and QFP packages (excluding VQFP and TQFP packages). | August 10, 1998 |
| PDN98006 | Discontinuation of the XC4003A M-grade and B-grade (SMD) Products. | June 26, 1998 |
| PDN98005 | Discontinuation of the XC3100A M-grade and B-grade (SMD) Products. | June 26, 1998 |
| PDN98004 | Discontinuation of the XC1718 Product (all temperature grades, voltage options, and package options). | June 26, 1998 |
| PCN98003 | The Xilinx XC9500 Product Family will be manufactured in the 0.5µM Flash Process at UMC. | June 24, 1998 |
| PCN98002A | Qualification of SPIL (Siliconware Precision Industries Company, Ltd.) of Taiwan as an alternate Assembly Subcontractor for BGA packages. | June 30, 1998 |
| PCN98002 | Qualification of SPIL (Siliconware Precision Industries Company, Ltd.) of Taiwan as an alternate Assembly Subcontractor for PQ and TQ packages. | May 18, 1998 |
| PDN98001 | Discontinuation of the MQFP (Metal Quad Flat Pack) package option for certain XC4000 products. | June 15, 1998 |