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| Number | Description | Effective Date |
| PCN96011 | An Evolutionary Change in the Xilinx XC5200 Fabrication Process | Dec 20, 1996 |
| PCN96010 | Discontinuance of the XC2000 Product Families (all speed grades and package options including B-Grade and SMD [Standard Military Drawing] Devices) | Dec 20, 1996 |
| PCN96009 | Discontinuation of the XC4000A and XC4000H Product Families | Oct 01, 1996 |
| PCN96008 | An Evolutionary Change in the Xilinx XC4000/D Fabrication | Oct 01, 1996 |
| PCN96007 | Discontinuance of the XC8100 Antifuse Product Line | Aug 09, f996 |
| PCN96006 | XC73144 PQ160: Cin Parameter Change | Jul 16, 1996 |
| PCN96005 | Qualification of A.S.E. Taiwan as a New Assembly Subcontractor | Jun 28, 1996 |
| PCN96004 | A New Wafer Foundry Partner United Microelectronics Corporation (UMC), for Xilinx Programmable Logic Products | May 15, 1996 |
| PCN96003 | Obsolescence of Commercial and Military CQFP-100 ceramic packages | May 03, 1996 |
| PCN96002A | Product Availability Extension of XC7300 CPLD family at the tsmc Manufacturing Facility | Jul 03, 1996 |
| PCN96002 | Qualification of Seiko Epson as a Manufacturing Facility for the XC7300 Product family | Apr 02, 1996 |
| PCN96001 | A Change in the Xilinx XC3100 Fabrication Process | Apr 19, 1996 |