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TABLE 1A


Plastic Package / Product Qualification Requirements per Die Size

TEST SEQ
TEST DESCRIPTION
ACC#/SAMPLE SIZE PER DIE SIZE CATEGORY (Note #2)
NEW PKG TYPE I
NEW PKG TYPE II
NEW PKG TYPE III LF DESIGN
LEAD FRAME
DIE ATTACH
DIE COAT
WIRE 
BOND
MOLD CPD
LEAD FINISH
NEW DEVICE MASK
NEW FAB PROCESS
FULL
QUAL
   
(Note #1)
 
CAT.1
CAT.2
CAT.3
(Note #3)
(Note #4)
(Note #5)
           
(Note #6)
 
(Note #9)
B1
  Solder Heat Test (Optional)  
0/15
0/15
0/15
   
X
X
     
X
     
X
B2
*
Resist. to Solvents
(Note #7)
0/3
0/3
0/3
X
           
X
X
   
X
B3
*
Solderability Test
(Note #7)
0/3
0/3
0/3
X
X
 
X
       
X
   
X
B4
*
Die Shear
(Note #7)
0/5
0/5
0/5
X
 
X
 
X
         
X
X
B5
*
Ball Shear/Bond Pull
(Note #7)
0/5
0/5
0/5
X
   
X
 
X
X
X
   
X
X
B6
*
External Visual
(Note #7)
0/25
0/25
0/25
X
X
X
X
     
X
     
X
B7
  Internal Visual
(Note #7)
0/5
0/5
0/5
X
X
X
X
X
X
X
   
X
X
X
B8
*
S.A.T./Dye Pen Test
(Note #7)
0/5
0/5
0/5
X
X
X
X
     
X
X
   
X
B9
  Auto Clave (SPP) (optional) 0/76  
0/76
0/32
0/22
X
X
X
X
 
X
 
X
     
X
B10
**
X-Ray
(Note #7)
0/5
0/5
0/5
X
X
X
   
X
X
X
     
X
B11
  Flammability Test
(Note #7)
Per lot
Per lot
Per lot
             
X
     
X
B12
*
Lead Material/Plating Thickness  
0/3
0/3
0/3
X
   
X
       
X
   
X
B13
  Process Cross Section  
2
2
2
                   
X
X
C1-A
  High Temp Life Test  
0/76
0/32
0/22
                 
X
X
X
C1-B
  Low Temp Life Test
(Note #7)
0/22
0/22
0/22
                   
X
X
C2
  C2-A: HAST (0/22) or C2-B: 85/85  
0/76
0/32
0/22
X
 
X
X
X
X
 
X
   
X
X
C3
  ESD (HBM)
(Note #8)
0/3 (9)
0/3 (9)
0/3 (6)
                 
X
 
X
C4
  High Temp Storage (Optional)  
0/77
0/32
0/22
             
X
   
X
X
D1
*
Physical Dimension  
0/5
0/5
0/5
X
X
         
X
X
   
X
D2
*
Lead Integrity  
0/3
0/3
0/3
X
X
 
X
       
X
   
X
D7
*
Adhesion of Lead Finish (Optional)
(Note #7)
0/3
0/3
0/3
X
   
X
       
X
   
X
D9
  Temp Cycle  
0/76
0/32
0/22
X
X
X
X
X
X
X
X
   
X
X
D10
  Thermal Shock (Optiona)  
0/76
0/32
0/22
                     
X
E1
  Electrical Test & Data Log  
0/30
0/20
0/10
                 
X
X
X
E2
  Electrical Characterization  
0/30
0/30
0/30
                 
X
X
X
E3
  T.D.D.B.
(Note #7)
-
-
-
                   
X
X
E4
  Latch-Up  
0/10
0/10
0/4
                 
X
 
X
E5
  Electromigration
(Note #7)
-
-
-
                   
X
X
E6
  Photosensitivity (Optional)  
0/11
0/11
0/11
                 
X
X
X
E7
  Data Retention Bake (EPLD & EPROM)  
0/45
0/22
0/15
                 
X
X
X
E8
  Input/Output Capacitance  
0/5
0/5
0/3
                 
X
 
X
E9
  Power Cycling  
0/76
0/32
0/22
                 
X
X
X
E10   CDM  
-
-
-
               
 
X (Note #10)
X
X
Qty required per lot
 
Electrically good
238/106/76
162/74/54
253/121/91
248/116/86
157/69/49
238/106/76
86/74/54
325
5
297/176/128
455/202/135
811/470/372
Electrical rejects
60
41
35
40
5
5
5
43
25
0
10
60
Total Units Required
298/166/136
203/115/95
288/156/126
288/115/95
162/74/54
243/111/81
91/79/59
368
30
297/176/128
465/212/145
871/530/432
1)
Refer to Table #2 for test method and stress conditions.
2)
Category 1 die size is <.571" x .643"; Category 2 die size is <.764" x .864"; Category 3 die size is >/=.764" x .864".
3)
Qualification of a new assembly plant or any new package which has not been qualified in a qualified assembly facility.
4)
Any new package where the same package body size with different lead pitch has been qualified.
5)
New leadframe design whereby the paddle size is larger than the existing largest leadframe paddle size used in the same qualified package.
6)
For new mask from same device family, HTOL may or may not be required; ESD, LATCH-UP, CAPACITANCE and CHARACTERIZATION DATA are required.
7)
In process monitor data may be used to satisfy this requirement.
8)
Acceptance criteria is 0/3, however 9 or 6 devices are required for ESD design characterization.
*
Electrical rejects can be used as test sample.
**
This is a non-destructive test; sample can be re-used.
9) A full qualification is for process, assembly site and package.
10) New device/new process - 1000 volt minimum.