|
|
ACC#/SAMPLE SIZE PER DIE SIZE CATEGORY (Note #2) |
|
|
|
|
|
|
BOND |
|
|
|
|
QUAL |
||||
|
|
|
|
|
|
|
|
|
||||||||||
|
Solder Heat Test (Optional) |
|
|
|
|
|
|
|
||||||||||
|
|
Resist. to Solvents |
(Note #7)
|
|
|
|
|
|
|
|
||||||||
|
|
Solderability Test |
(Note #7)
|
|
|
|
|
|
|
|
|
|||||||
|
|
Die Shear |
(Note #7)
|
|
|
|
|
|
|
|
|
|||||||
|
|
Ball Shear/Bond Pull |
(Note #7)
|
|
|
|
|
|
|
|
|
|
|
|||||
|
|
External Visual |
(Note #7)
|
|
|
|
|
|
|
|
|
|
||||||
|
Internal Visual |
(Note #7)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
S.A.T./Dye Pen Test |
(Note #7)
|
|
|
|
|
|
|
|
|
|
|
|||||
|
Auto Clave (SPP) (optional) 0/76 |
|
|
|
|
|
|
|
|
|
|
|||||||
|
|
X-Ray |
(Note #7)
|
|
|
|
|
|
|
|
|
|
|
|||||
|
Flammability Test |
(Note #7)
|
|
|
|
|
|
|||||||||||
|
|
Lead Material/Plating Thickness |
|
|
|
|
|
|
|
|||||||||
|
Process Cross Section |
|
|
|
|
|
||||||||||||
|
High Temp Life Test |
|
|
|
|
|
|
|||||||||||
|
Low Temp Life Test |
(Note #7)
|
|
|
|
|
|
|||||||||||
|
C2-A: HAST (0/22) or C2-B: 85/85 |
|
|
|
|
|
|
|
|
|
|
|
||||||
|
ESD (HBM) |
(Note #8)
|
|
|
|
|
|
|||||||||||
|
High Temp Storage (Optional) |
|
|
|
|
|
|
|||||||||||
|
|
Physical Dimension |
|
|
|
|
|
|
|
|
||||||||
|
|
Lead Integrity |
|
|
|
|
|
|
|
|
||||||||
|
|
Adhesion of Lead Finish (Optional) |
(Note #7)
|
|
|
|
|
|
|
|
||||||||
|
Temp Cycle |
|
|
|
|
|
|
|
|
|
|
|
|
|
||||
|
Thermal Shock (Optiona) |
|
|
|
|
|||||||||||||
|
Electrical Test & Data Log |
|
|
|
|
|
|
|||||||||||
|
Electrical Characterization |
|
|
|
|
|
|
|||||||||||
|
T.D.D.B. |
(Note #7)
|
|
|
|
|
|
|||||||||||
|
Latch-Up |
|
|
|
|
|
||||||||||||
|
Electromigration |
(Note #7)
|
|
|
|
|
|
|||||||||||
|
Photosensitivity (Optional) |
|
|
|
|
|
|
|||||||||||
|
Data Retention Bake (EPLD & EPROM) |
|
|
|
|
|
|
|||||||||||
|
Input/Output Capacitance |
|
|
|
|
|
||||||||||||
|
Power Cycling |
|
|
|
|
|
|
|||||||||||
E10 | CDM |
|
|
|
|
|
|
|
||||||||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
|
|
||||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Refer to Table #2 for test method and stress conditions. |
|
Category 1 die size is <.571" x .643"; Category 2 die size is <.764" x .864"; Category 3 die size is >/=.764" x .864". |
|
Qualification of a new assembly plant or any new package which has not been qualified in a qualified assembly facility. |
|
Any new package where the same package body size with different lead pitch has been qualified. |
|
New leadframe design whereby the paddle size is larger than the existing largest leadframe paddle size used in the same qualified package. |
|
For new mask from same device family, HTOL may or may not be required; ESD, LATCH-UP, CAPACITANCE and CHARACTERIZATION DATA are required. |
|
In process monitor data may be used to satisfy this requirement. |
|
Acceptance criteria is 0/3, however 9 or 6 devices are required for ESD design characterization. |
|
Electrical rejects can be used as test sample. |
|
This is a non-destructive test; sample can be re-used. |
9) | A full qualification is for process, assembly site and package. |
10) | New device/new process - 1000 volt minimum. |