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ACC#/SAMPLE SIZE
PER DIE SIZE CATEGORY
(Note #2) |
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Solder Heat Test (Optional) |
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Resistance To Solvents |
(Note #7)
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Solderability Test |
(Note #7)
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Die Shear / Stud Pull |
(Note #7)
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Bond Pull |
(Note #7)
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External Visual |
(Note #7)
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Internal Visual |
(Note #7)
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Lead Material/Plating Thickness |
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Process Cross Section |
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High Temp Life Test |
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Low Temp Life Test |
(Note #7)
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ESD (HBM) |
(Note #8)
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High Temp Storage (Optional) |
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Physical Dimension |
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Lead Integrity |
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Thermal Shock + Temp Cycle + Moisture Resistance |
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Mechanical Shock + Vibration + Constant Acceleration |
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Salt Atmosphere |
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Internal Vapor Content |
(Note #7)
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Adhesion of Lead Finish (Optional) |
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Lid Torque |
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Temp Cycle |
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Electrical Test & Datalog |
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Electrical Characterization |
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T.D.D.B. |
(Note #7)
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Latch-Up |
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Electromigration |
(Note #7)
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Photosensitivity (Optional) |
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Data Retention Bake (EPLD & EPROM) |
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Input/Output Capacitance |
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Power Cycling |
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Qty required per lot |
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Notes:
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Refer to Table #2 for test method and stress conditions. |
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Category 1 die size is <.571" x .643"; Category 2 die size is <.764" x .864"; Category 3 die size is >/=.764" x .864". Refer to Section 8.1. |
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Qualification of a new assembly plant, or, any new package which has not been qualified in the qualified assembly facility. |
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Package Type - A package with a unique case outline, configuration, material, piece parts and assembly processes. |
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Applicable to new piece parts or leadframe where the cavity size is larger than the largest cavity size for the same package. |
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For new mask from same device family, HTOL may or may not be required; ESD, LU, CAP and CHARDATA are required. |
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In process monitor data may be used to satisfy this requirement; for Qual data, data from Assy lot traveller may be used. |
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Acceptance criteria is 0/3, however 9 devices are required for ESD design characterization. |
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A full qualification is for process, assembly site and package. |
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Electrical rejects can be used as test sample. |