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TABLE 2B


Hermetic Package / Product Monitor Requirements and Test Conditions

TEST SEQ
TEST DESCRIPTION
REFERENCE SPEC 
Mil-Std-883 / JEDEC/STACK
XILINX
TEST OR STRESS CONDITIONS
PRODUCT MONITOR SAMPLE SIZES
PRODUCT MONITOR FREQUENCY
Notes (#1)
B
PACKAGE/PROCESS
CAT.1 
CAT.2
CAT.3 
 
B1
Solder Heat Test (Optional)
JEDEC Mtd A112
D1005
RTP0024
Immersion in solder @ 260 °C for 12 sec 
End-point electrical parameter @ 25 °C
-
For Qualification only
 
B2
Resistance to Solvents
Mil-Std-883 Mtd 2015
B1026
1 device per chemical for 1 minute, then brush 10 times
0/3
In-line Process Monitor
 
B3
Solderability Test
Mil-Std-883 Mtd 2003 STACK 0001 Test 5
B1023
RTP0024
8 hrs steam age: TH: 245 °C / 5 sec 
SMC: 215 °C for 5 sec (wetting) 
SMC: 260 °C for 10 sec (dewetting)
0/22
(3 units)
In-line Process Monitor
#2, #11
B4
Die Shear / Stud Pull
Mil-Std-883 Mtd 2019
N/A
Die Shear strength > 5.0 kg
0/5
In-line Process Monitor
#11
B5
Bond Pull
Mil-Std-883 Mtd 2011
N/A
Bond Pull strength > 2 gm
0/15
(4 units)
In-line Process Monitor
#6, #11
B6
External Visual
Mil-Std-883 Mtd 2009
N/A
Package defects, Lead defects
0/25
In-line Process Monitor
#11
B7
Internal Visual
Mil-Std-883 Mtd 2010
N/A
Die defects, die-attach defects and wirebond defects
0/5
In-line Process Monitor
#11
B12
Lead Material/Plating
Thickness (Optional)
     
-
   
B13
Process Cross-Section     Cross-Section shall be performed by the fabrication facility or by the Xilinx Process Technology Department. For Qualification: all layers are shown with measurements.  For Monitors: vias, contacts and metal step coverage measurements are required.
-
   
C
MICRO CIRCUIT FAMILY
C1-A
High Temp Life Test
Mil-Std-883 Mtd 1005
RTP0003
125 °C / 168, 500 and 1000 hrs or equivalent 
End-point electrical test @ 25 °C, verify device parameter drift (<10%)
LTPD 5 0/45
LTPD 7 0/32
LTPD 10 0/22
1x / 6 months
#3, #4,
#5, #8
C1-B
Low Temp Life Test
Mil-Std-883 Mtd 1005
N/A
< -10 ° C/1000 hrs 
End-point electrical test @ 25 °C, verify device parameter drift (<10%)
-
In-line Process Monitor
#11
C3
ESD (HBM)
Mil-Std-883 Mtd 3015
TSP0001
RTP0032
3 positive and 3 negative pulses, all pins tested, 2000 volts min.
-
For Qualification only
 
C4
High Temp Storage
(Optional)
Mil-Std-883 Mtd 1008
RTP0028
150 °C / 500, 1000 hrs 
End-point electrical test @ 25 °C
-
For Qualification only
 
D
PACKAGE DESIGN
D1
Physical Dimension
Mil-Std-883 Mtd 2016
B1027
Per applicable package outline drawing 

 

0/5
1x / 6 months
#2, #8
D2
Lead Integrity 

Seal (Fine/Gross)

Mil-Std-883 Mtd 2004
Mil-Std-883 Mtd 2028
Mil-Std-883 Mtd 1014
B1063/62
B1064
B1024
Condition B2 (Use Condition B1 for leaded chip carrier pkgs 
Condition A, Tracer gas (He) fine leak & 
Condition C, Perfluorocarbon gross leak
0/45
(3 units)
1x / 6 months
#2, #6,
#7, #8
D3
Thermal Shock + 
Temp Cycle + Moisture Resistance Seal
(Fine/Gross)
Mil-Std-883 Mtd 1011
Mil-Std-883 Mtd 1010
Mil-Std-883 Mtd 1004
Mil-Std-883 Mtd 1014
B1001
B1002
B1049
B1005
Condition C, -65/150 °C (Liquid to Liquid), 15 cycles 
Condition C, -65/150 °C (Air to Air), 100 cycles 
90% RH/ -10/25/65 °C, 10 cycles 
Condition A, Tracer gas (He) fine leak & 
Condition C, Perfluorocarbon gross leak
0/15
1x / 6 months
#2, #8,
#9
  Visual Examination
Mil-Std-883 Mtd 1011 & Mtd 1004
B1006
B1007
Per visual criteria in Method 1011 and Method 1004 
End-point electrical Test @ 25 °C
     
D4
Mechanical Shock + 
Variable Frequency Vibration + Constant Acceleration 

Seal (Fine/Gross)

Mil-Std-883 Mtd 2002
Mil-Std-883 Mtd 2007
Mil-Std-883 Mtd 2001

Mil-Std-883 Mtd 1014

B1083
B1076
B1008

B1005

Condition B, 1500 G Peak, 0.5 msec pulse duration 
Condition A, at peak acceleration of 20 g 
Condition E - For Pkg < 5 gms or inner sealed cavity < 2 inches 
Condition D - For Pkg >= 5 gms or inner sealed cavity >= 2 inches 
Condition A, Tracer gas (He) fine leak &
0/15
 

1x / 6 months
#2, #8
  Visual Examination
Mil-Std-883 Mtd 1011 & Mtd 1004
B1006
B1007
Condition C, Perfluorocarbon gross leak 
Per visual criteria in Method 1011 and Method 1004 
End-point electrical test @ 25 °C
     
D5
Salt Atmosphere 
Visual Examination 
Seal (Fine/Gross)
Mil-Std-883 Mtd 1009
Mil-Std-883 Mtd 1009
Mil-Std 883 Mtd 1014
B1050
B1027
B1005
B1006
Condition A, soak time = 24 hrs 
Per visual criteria in method 1009 
Condition A, Tracer gas (He) fine leak & 
Condition C, Perfluorocarbon gross leak
-
For Qualification only
 
D6
Internal Vapor Content
Mil-Std-883 Mtd 1018
B1010
5000 ppm max. at 100 °C
0/3
1x / 6 months
#2, #8,
#11
D7
Adhesion of Lead Finish
(Optional)
Mil-Std-883 Mtd 2025
B1018
Bend Coated lead at an angle of 90° until fracture occurs. 
No flaking, peeling or detachment of coating at the interface.
-
For Qualification only
 
D8
Lid Torque
Mil-Std-883 Mtd 2024
B1048
Applicable to Glass Frit Sealed Package only 
The Torque value must meet the minimum limits as specified in 
Table #1 of the Mil-Std-883 Method 2024.2
0/5
1x / 6 months
#2, #8
D9
Temp Cycle 
Seal (Fine/Gross)
Mil-Std-883 Mtd 1010
Mil-Std-883 Mtd 1014
B1002
B1005
B1006
Condition C -65/150 °C, 500 cycles 
Condition A, Tracer gas (he) fine leak & 
Condition C, Perfluorocarbon gross leak 
End-point electrical test @ 25 °C
LTPD 5 0/45
LTPD 7 0/32
LTPD 10 0/22
1x / 6 months
#2, #5
E
ELECTRICAL ENDURANCE/EVALUATION & PROCESS VALIDATION DATA
E1
Electrical Test
& Datalog
STACK 0001, Test 1c
  @ 25 °C, Top min. & Top max.
-
New Prod. Characterization
 
E2
Electrical
Characterization
STACK 0001, Test 1d
  Schmoo plot & Temperature trends for critical parameters
-
New Prod. Characterization
 
E3
T.D.D.B.
STACK 0001, Test 38
  Characterization of oxide integrity
-
In-line Process Monitor
#10, #11
E4
Latch-Up
JEDEC-STD-17
TSP0006
 
a) Immunity to PSOV of 20% over absolute Maximum voltage 
b) Immunity to +/-200mA current injection into I/O pins
-
New Prod. Characterization
 
E5
Electromigration
STACK 0001, Test 39
  Characterization of Metallisation system 
> 100,000 hours for 0.1% cumulative failures 
> 100,000 hours for 50% cumulative failures
-
In-line Process Monitor
#11
E6
Photosensitivity
(Optional)
STACK 0001, Test 37
  Apply 25W neon bulb, distance = 50 cm during electrical test.  
New Prod. Characterization
 
E7
Data Retention Bake
Mil-Std-883 Mtd 1033
RTP0028
Write device with suitable pattern, bake @ 150 °C for 1000 hrs 
Read and confirm data pattern 
End-point electrical test @ 25 °C
-
New Prod. Characterization
#12
E8
Input/Output
Capacitance
Mil-Std-883 Mtd 3012
RTP0031
Biased @ nominal operating voltage
-
New Prod. Characterization
 
E9
Power Cycling  
RTP0029
5000 cycles @ 50 °C with Vcc = 5.0V 
Vpp = 12 to 12.5 V
-
New Product Characterization
 

Notes:
1)
For any Qualification or Product Monitor where sample size does not meet the Standard Quality level, approval from Product Engineering and Product QA is required.
2) The Product Monitor Frequency applies to each package family with assembly locations and package type rotated each Quarter (when applicable). If only one package type exists within a package family, the product monitor frequency will be 1x / 12 months, minimum.
3) The Product Monitor Frequency applies to each Micro Circuit Family. Plastic monitor data may be used to satisfy this requirement.
4) End-point electrical test shall be performed within 48 hrs window.
5) Interim read point is optional.
6) The sample size is for numbers of bonds or numbers of leads.
7) For LCC packages, use LTPD 15, 15 (0,1).
8) Military QCI monitor data may be used to satisfy this requirement.
9) End-point electrical test @ 25 °C shall be performed within 48 hrs after moisture resistance test.
10) T.D.D.B. - Time Dependent Dielectric Breakdown
11) In process monitor data may be used to satisfy the Qualification requirement; refer to Assembly Qualification lot traveller or Fab monitor data.
12) Not applicable to FPGA's; H.T.O.L. test data @ 150 +0/-5 °C may be used to satisfy this requirement.