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| 1 July 1999
Subject: Product Discontinuation Notification (PDN99004). "Discontinuance of Die and Wafer Sales for all Xilinx Product Families". Change Description: Xilinx is discontinuing the sale of singulated die and wafers for all products. Product Change: Specific die/mask sets supporting the Xilinx product lines were previously offered for sale by Xilinx. Effective on the dates below, Xilinx will no longer make such die or wafers available. Reason For Change: This decision is due to the very low market demand for bare die products. The increases in integration levels of Xilinx products combined with advanced packaging technologies continues to outpace MCM/hybrid technology, further reducing the demand for bare die products. Key Dates:
Response: No response to this notification is required. Requests for additional data or support should be made within 90 days of notification. Please address any questions you may have via e-mail at "pcn@xilinx.com", or directly by fax at 408 559 1368. Sincerely, Joseph J. Fabula
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