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Reliability Testing Summary - Page 1 of 2
HQ240 Package (Insulated Heatsink)


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Technology: Si Gate CMOS
Device Type: XC4025E & XC4013E
Package Type: HQ240 Thermally Enhanced PQFP
Molding Compound:   Sumitomo 7304LC/F









      Pre. Cond.
0.0621%
    85°C / 85%     Pressure Pot     Temp. Cycle
  30/60%
192 Hrs.
3 V.P. 219°C
1,000 Hrs. 96 Hrs.
121°C/2 Atm.
542 Cycs.
-65°C / +150°C
Combined Started Lot: 1 1 1 1
Combined Completed Lots: 1 1 1 1
Failures: 0 0 0 0
Device on Test: 111 44 45 21
Actual Device Hours / Cycles: 21,312 44,000 4,320 11,382
Mean: 192 1,000 96 542
          
Physical Dimension: Passed
Solderability: Passed
Internal Visual: Passed
Lead Integrity: Passed
Peel Test / X-Ray: Passed