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Thermal Data for PCN 97009A
Thermally Enhanced Plastic Quad Flat Pack (PQFP)



 

Still Air Data Comparison:
HQFP
 (Current Non-Insulated) 
HQFP
 (Insulated) 
   PQFP 
(Std)
JA (°C/watt)
JA (°C/watt)
               JA (°C/watt) 
208 pins
14 - 15
14 - 16
25 - 32
240 pins
11 - 14
11 - 15
18 - 28
 

Notes:
1. JC Data:
     HQFP (Thermally Enhanced) = 0.7 - 1.2°C/watt, typical.
     PQFP (Standard PQFP) = 2.0 - 7.0°C/watt, typical.
2. Test Conditions per JEDEC JC15.1.
3. Data measured using a 4-layer test board.
4. Used Delco Thermal Die. Die sizes vary, compatible to Xilinx device sizes.