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1998 Product Change Notifications
| Number |
Description |
Effective Date |
| PCN98007 |
A change in the mold compound and die attach epoxy used to fabricate
Xilinx PLCC and QFP packages (excluding VQFP and TQFP packages). |
August 10, 1998 |
| PDN98006 |
Discontinuation of the XC4003A M-grade and B-grade (SMD) Products. |
June 26, 1998 |
| PDN98005 |
Discontinuation of the XC3100A M-grade and B-grade (SMD) Products. |
June 26, 1998 |
| PDN98004 |
Discontinuation of the XC1718 Product (all temperature grades,
voltage options, and package options). |
June 26, 1998 |
| PCN98003 |
The Xilinx XC9500 Product Family will be manufactured in the 0.5µM
Flash Process at UMC. |
June 24, 1998 |
| PCN98002A |
Qualification of SPIL (Siliconware Precision Industries Company, Ltd.)
of Taiwan as an alternate Assembly Subcontractor for BGA packages. |
June 30, 1998 |
| PCN98002 |
Qualification of SPIL (Siliconware Precision Industries Company, Ltd.)
of Taiwan as an alternate Assembly Subcontractor for PQ and TQ packages. |
May 18, 1998 |
| PDN98001 |
Discontinuation of the MQFP (Metal Quad Flat Pack) package option for
certain XC4000 products. |
June 15, 1998 |
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