When it comes to personal and portable electronic devices, smaller is better. Xilinx leads the way in advanced packaging innovation by offering a full line of Chip Scale Packages (CSP). This advanced technology is perfect for applications that need the smallest board area possible. Our CSP solutions offer the smallest form-factor packages available today for a CPLD, taking up less board space, and allowing for a smaller overall end-product. Applications that are board size-sensitive such as digital cameras, cellular phones and PCMCIA cards will benefit from the small size of these packages. Overall, our CSP solutions offer:

• Maximum board space savings
• Easy & cost effective manufacturing
• Broad product offering

Maximum Board Space Savings

Since chip scale packages are about 1/3 the size of traditional PLCC and QFP packages, Xilinx CSPs allow for the same density to fit into 1/3 the original space. This poses significant benefits to portable end products or any system design where board space is a premium.

Easy & Cost Effective Manufacturing

In addition to board space savings, chip scale packages simplify and streamline the manufacturing process by eliminating many of the requirements for handling and lead coplanarity since there are no fragile leads to bend. Also, since the device signal I/Os are located at the edge of the package, less PCB layers are required to route the design (see diagram below for example). These combined benefits help to reduce overall manufacturing cost.

Broad Product Offering

Chip Scale Package solutions from Xilinx offer a whole new dimension in board space savings and flexibility. The easy-to-handle CSP fits more density into less space. The XC9500XL/XV and CoolRunner XPLA3 CPLD families offer a full line of 0.8-mm ball pitch CSPs , including 48-, 144- and 280-ball configurations. The CoolRunner XPLA3 family also offers an even smaller 0.5-mm pitch CSP featuring 56-balls.