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TEST SEQ
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TEST DESCRIPTION |
REFERENCE SPEC Mil-Std-883 / JEDEC/STACK
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XILINX
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TEST OR STRESS CONDITIONS
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PRODUCT MONITOR SAMPLE SIZES
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PRODUCT MONITOR FREQUENCY
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Notes (#1)
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B
|
PACKAGE/PROCESS |
CAT.1
|
CAT.2
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CAT.3
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B1
|
Solder Heat Test
(Optional) |
JEDEC Std-22 Mtd A112
|
B1005
RTP0024
|
Immersion in solder @ 260 °C for 12 sec
End-point electrical test @ 25 °C |
-
|
For Qualification only
|
#4
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|
B2
|
Resistance to Solvents |
Mil-Std-883 Mtd 2015
|
B1026
|
1 device per chemical for 1 minute, then brush
10 times |
0/3
|
In-line Process Monitor
+ 1x / 3 months
|
#2, #16
|
|
B3
|
Solderability Test |
Mil-Std-883 Mtd 2003 STACK 0001 Test 5
|
B1023
RTP0024
|
8 hrs steam age: PTH: 245 °C / 5 sec
PSMC: 215 °C for 5 sec (wetting)
PSMC: 260 °C for 10 sec (dewetting) |
0/22
(3 units)
|
In-line Process Monitor
+ 1x / 3 months
|
#2, #13,
#14, #16
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B4
|
Die Shear |
Mil-Std-883 Mtd 2019
|
|
Die Shear strength > 5.0 kg |
0/5
|
In-line Process Monitor
|
#16
|
|
B5
|
Ball Shear and
Bond Pull |
STACK 0001 Test 6
|
B1004
|
Ball shear strength > 50 gm
Bond pull strength > 5.0 gm |
0/10 (2 units)
0/8 (2 units)
|
In-line Process Monitor
|
#16
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B6
|
External Visual |
Mil-Std-883 Mtd 2009
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|
Package defects, Lead defects |
0/25
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In-line Process Monitor
|
#16
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|
B7
|
Internal Visual |
Mil-Std-883 Mtd 2010
|
|
Die defects, die-attach and wirebond defects |
0/5
|
In-line Process Monitor
|
#16
|
|
B8
|
S.A.T. and Dye Pen.
Test |
-
|
|
Scanning Acoustic Tomograpy
60 psig / 2 hrs. Dye Pen. < 10 mils from lead tip |
0/5
|
For Qualification and Monitor
|
#11, #16
|
|
B9
|
Auto Clave (SPP) |
JEDEC Std-22 Mtd A102
|
RTP0002
|
Preconditioning flow #1 or #2 (for PSMC only)
96 hrs @ 2 ATM with saturated steam @ 121 °C
End-point electrical parameter @ 25 °C |
LTPD 5 0/45
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LTPD 7 0/32
|
LTPD 10 0/22
|
1x / 3 months
|
#2, #6,
#14
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|
B10
|
X-Ray |
-
|
|
Wire sweep, Package void and Epoxy void |
0/5
|
In-line Process Monitor
|
#16
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|
B11
|
Flammability |
UL-94 V0
|
|
Bulk material in C of C per material shipment |
-
|
|
#16
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|
B12
|
Lead Material/Plating Thickness
(Optional) |
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|
-
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B13
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Process
Cross-Section |
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Cross Section shall be performed by the fabrication
facility or by the Xilinx Process Technology Department. For Qualification:
all layers are shown with measurements. For Monitors: vias, contacts and
metal step coverage measurements are required. |
-
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|
C
|
MICRO CIRCUIT
FAMILY |
|
C1-A
|
High Temp Life Test |
Mil-Std-883 Mtd 1005
|
RTP0003
|
145 ° C/256/500 and 1000 hrs or equivalent
End-point electrical test @ 25 °C, verify device
parameter drift (<10%) |
LTPD 5 0/45
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LTPD 7 0/32
|
LTPD 10 0/22
|
1x / 3 months
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#3, #6,
#12
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C1-B
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Low Temp Life Test |
Mil-Std-883 Mtd 1005
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< -10 ° C/1000 hrs
End-point electrical test @ 25 °C, verify device
parameter drift (<10%) |
-
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For Qualification only
|
#16
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|
C2-A
|
85 °C/ 85% RH |
JEDEC Std-22 Mtd A101
|
RTP0006
|
Preconditioning flow #1 or #2 (for PSMC only)
End-point electrical test @ 25 °C (for PSMC only)
85 ° C / 85% RH static bias for 168, 500, 1000 hrs
End-point electrical test @ 25 °C |
LTPD 5 0/45
|
LTPD 7 0/32
|
LTPD 10 0/22
|
1x / 3 months
|
#2, #5,
#8, #12,
#14
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|
C2-B
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HAST |
JEDEC Std-22 Mtd 110
|
RTP0011
|
Preconditioning flow #1 or #2 (for PSMC only)
End-point electrical test @ 25 °C (for PSMC only)
HAST -130 °C / 85% RH static bias for 50, 100 hrs
End-point electrical test @ 25 °C |
LTPD 10 0/22
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LTPD 15 0/15
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LTPD 20 0/11
|
1x / 3 months
|
#2, #5,
#9, #14
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C3
|
ESD (HBM) |
Mil-Std-883 Mtd 3015
|
TSP0001
RTP0032
|
3 positive and 3 negative pulses, all pins
tested, 2000 volt minimum |
-
|
For Qualification only
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|
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C4
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High Temp Storage (Optional) |
Mil-Std-883 Mtd 1008
|
RTP0028
|
150 °C/500, 1000 hrs
End-point electrical test @ 25 °C |
-
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For Qualification only
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#12
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D
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PACKAGE DESIGN |
CAT.1
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CAT.2
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CAT.3
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D1
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Physical Dimension |
Mil-Std-883 Mtd 2016
|
B1027
|
Per applicable pkg outline drawing |
0/5
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1x / 3 months
|
#2
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|
D2
|
Lead Integrity |
Mil-Std-883 Mtd 2004
|
B1024
|
Condition B2 |
0/15 (3 units)
|
1x / 3 months
|
#2
|
|
D5
|
Salt Atmosphere
Visual Examination
Seal (Fine/Gross) |
Mil-Std-883 Mtd 1009
Mil-Std-883 Mtd 1009
Mil-Std-883 Mtd 1014 |
B1050
B1027
B1005
B1006
|
Cond A, soak time = 24 hrs
Per visual criterial in Method 1009
Condition A, Tracer gas (He) fine leak & Condition
C, Perfluorocarbon gross leak |
0/15 for N-grade monitoring only
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|
|
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D7
|
Adhesion of
Lead Finish
(Optional) |
Mil-Std-883 Mtd 2025
|
B1018
|
Bend coated lead at an angle of 90 ° until
fracture occurs.
No flaking, peeling or detachment of coating at the interface. |
-
|
For Qualification only
|
|
|
D9
|
Temp Cycle |
Mil-Std-883 Mtd 1010
|
PSP822
RTP0022
|
Preconditioning flow #1 or #2 (for PSMC only)
End-point electrical test @ 25 °C (for PSMC only)
Condition C -65/150 °C, 500 cycles
End-point electrical test @ 25 °C |
LTPD 5 0/45
|
LTPD 7 0/32
|
LTPD 10 0/22
|
1x / 3 months
|
#2, #7
#14
|
|
D10
|
Thermal Shock |
Mil-Std-883 Mtd 1011
|
RTP0001
|
Condition C, -65/150 °C, 100 cycles
End-point electrical test @ 25 °C |
LTPD 5 0/45
|
LTPD 7 0/32
|
LTPD 10 0/22
|
1x / 3 months
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#2, #7
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|
E
|
ELECTRICAL
ENDURANCE / EVALUATION AND PROCESS VALIDATION |
|
E1
|
Electrical Test
& Datalog |
STACK 0001, Test 1c
|
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@ 25 °C, minimum and maximum operating
temp |
0/10
|
New Product Characterization
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|
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E2
|
Electrical
Characterization |
STACK 0001, Test 1d
|
TSP0003
|
Shmoo plot and temp trend for critical parameters |
-
|
New Product Characterization
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|
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E3
|
T.D.D.B. |
STACK 0001, Test 38
|
|
Characterization of oxide integrity |
|
In-line Process Monitor
|
#10, #16
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E4
|
Latch-Up |
Jedec STD 17
|
TSP0006
|
a) Immunity to PSOV of 20% over absolute Maximum
voltage
b) Immunity to +/-200mA current injection into I/O pins |
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New Product Characterization
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E5
|
Electromigration |
STACK 0001, Test 39
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Characterization of Metallisation system
> 100,000 hours for 0.1% cumulative failures
> 100,000 hours for 50% cumulative failures |
|
In-line Process Monitor
|
#16
|
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E6
|
Photosensitivity
(Optional) |
STACK 0001, Test 37
|
|
Apply 25W neon bulb, distance = 50 cm during
electrical test |
|
New Product Characterization
|
|
|
E7
|
Data Retention Bake |
Mil-Std-883 Mtd 1033
|
RTP0028
|
Write device with suitable pattern, bake @
150 °C for 1000 hrs
Read and confirm data pattern
End-point electrical test @ 25 °C |
-
|
New Product Characterization
|
#15
|
|
E8
|
Input/Output
Capacitance |
Mil-Std-883 Mtd 3012
|
RTP0031
|
Device shall be biased @ nominal operating
voltage |
-
|
New Product Characterization
|
|
|
E9
|
Power Cycling |
|
RTP0029
|
5000 cycles @ 50 °C with Vcc = 5.0V
Vpp = 12 to 12.5 V |
-
|
New Product Characterization
|
|
|
1)
|
For any Qual or Product Monitor where sample size does
not meet the Standard Quality level, approval from Product Engineering
and Product QA is required. |
| 2) |
The Product Monitor Frequency applies to each package
family with assembly locations and package type rotated each Quarter (when
applicable). |
| 3) |
The Product Monitor Frequency applies to each Micro Circuit
Family, each Quarter. |
| 4) |
For Moisture sensitive PSMC, a bake @ 125 °C for
16 hrs prior to solder heat test is required. |
| 5) |
End-point electrical test shall be performed within 48
hrs window. |
| 6) |
End-point electrical test shall be performed within 96
hrs window. |
| 7) |
For Plastic encapsulated laminated PCB package, use condition
B, -55 / 125 °C. |
| 8) |
85/85 Test is not required if HAST test is used. |
| 9) |
HAST Test data is for information and not required for
qualification. |
| 10) |
T.D.D.B. - Time Dependent Dielectric Breakdown. |
| 11) |
Dye Penetration test will be used as verification after
S.A.T. |
| 12) |
Interim read point is optional. |
| 13) |
PTH - Plastic Through Hole. |
| 14) |
PSMC - Plastic Surface Mount Component. |
| 15) |
Not applicable to FPGA's; H.T.O.L. test data @ 150 +0/-5
°C may be used to satisfy this requirement. |
| 16) |
In process monitor data may be used to satisfy this qual
requirement, refer to assembly lot traveller or FAB/Assembly/Vendor monitor
data. |
