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Module 1:  (167 KB) Introduction and Ordering Information v1.3 (1/25/01)
- Summary of Features
- General Description
- Device/Package Combinations and Maximum I/O
- Ordering Information
Module 2: (664 KB) Detailed Functional Description v1.3 (1/25/01)
- Detailed Description
- Digitally Controlled Impedance (DCI)
- Configurable Logic Blocks (CLBs)
- Sum of Products
- 3-State Buffers
- 18-Kbit Block SelectRAM Resources
- 18-Bit x 18-Bit Multipliers
- Global Clock Multiplexer Buffers
- Digital Clock Manager (DCM)
- Active Interconnect Technology
- Creating a Design
- Configuration
- Power-Down Sequence
Module 3: (637 KB) DC and Switching Characteristics v1.3 (1/25/01) 
- Electrical Characteristics
- Performance Characteristics
- Switching Characteristics
- Pin-to-Pin Output Parameter Guidelines
- Pin-to-Pin Input Parameter Guidelines
- DCM Timing Parameters
Module 4: (4.76 MB) Pinout Tables v1.4 (2/7/01)
- Pin Definitions
- Pinout Tables
- CS144 Chip-Scale BGA Package
- FG256 Fine-Pitch BGA Package
- FG456 Fine-Pitch BGA Package
- FG676 Fine-Pitch BGA Package
- BG575 Standard BGA Package
- BG728 Standard BGA Package
- FF896 Flip-Chip Fine-Pitch BGA Package
- FF1152 Flip-Chip Fine-Pitch BGA Package
- FF1517 Flip-Chip Fine-Pitch BGA Package
- BF957 Flip-Chip BGA Package
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