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Module 1:
(130 KB) Introduction and Ordering Information
v1.7 (10/02/01)
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Summary of Features
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General Description
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Device/Package
Combinations and Maximum I/O
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Ordering Information
Module 2:
(550 KB) Detailed Functional Description v1.8
(10/12/01)
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Detailed Description
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Digitally Controlled
Impedance (DCI)
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Configurable Logic
Blocks (CLBs)
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Sum of Products
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3-State Buffers
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18-Kbit Block SelectRAM
Resources
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18-Bit x 18-Bit
Multipliers
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Global Clock Multiplexer
Buffers
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Digital Clock Manager
(DCM)
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Active Interconnect
Technology
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Creating a Design
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Configuration
Module 3:
(290 KB) DC and Switching Characteristics v1.9
(10/12/01)
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Electrical Characteristics
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Performance Characteristics
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Switching Characteristics
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Pin-to-Pin Output
Parameter Guidelines
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Pin-to-Pin Input
Parameter Guidelines
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DCM Timing Parameters
Module 4:
(1.35 MB) Pinout Tables v1.5 (4/2/01)
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Pin Definitions
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Pinout Tables
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CS144 Chip-Scale
BGA Package
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FG256 Fine-Pitch
BGA Package
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FG456 Fine-Pitch
BGA Package
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FG676 Fine-Pitch
BGA Package
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BG575 Standard
BGA Package
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BG728 Standard
BGA Package
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FF896 Flip-Chip
Fine-Pitch BGA Package
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FF1152 Flip-Chip
Fine-Pitch BGA Package
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FF1517 Flip-Chip
Fine-Pitch BGA Package
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BF957 Flip-Chip
BGA Package
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