|
![](/bvdocs/images/dot_clear.gif) |
Module 1:
(130 KB) Introduction and Ordering Information
v1.7 (10/02/01)
-
Summary of Features
-
General Description
-
Device/Package
Combinations and Maximum I/O
-
Ordering Information
Module 2:
(550 KB) Detailed Functional Description v1.8
(10/12/01)
-
Detailed Description
-
Digitally Controlled
Impedance (DCI)
-
Configurable Logic
Blocks (CLBs)
-
Sum of Products
-
3-State Buffers
-
18-Kbit Block SelectRAM
Resources
-
18-Bit x 18-Bit
Multipliers
-
Global Clock Multiplexer
Buffers
-
Digital Clock Manager
(DCM)
-
Active Interconnect
Technology
-
Creating a Design
-
Configuration
Module 3:
(290 KB) DC and Switching Characteristics v1.9
(10/12/01)
-
Electrical Characteristics
-
Performance Characteristics
-
Switching Characteristics
-
Pin-to-Pin Output
Parameter Guidelines
-
Pin-to-Pin Input
Parameter Guidelines
-
DCM Timing Parameters
Module 4:
(1.35 MB) Pinout Tables v1.5 (4/2/01)
-
Pin Definitions
-
Pinout Tables
-
CS144 Chip-Scale
BGA Package
-
FG256 Fine-Pitch
BGA Package
-
FG456 Fine-Pitch
BGA Package
-
FG676 Fine-Pitch
BGA Package
-
BG575 Standard
BGA Package
-
BG728 Standard
BGA Package
-
FF896 Flip-Chip
Fine-Pitch BGA Package
-
FF1152 Flip-Chip
Fine-Pitch BGA Package
-
FF1517 Flip-Chip
Fine-Pitch BGA Package
-
BF957 Flip-Chip
BGA Package
|
![](/bvdocs/images/dot_clear.gif) |
|