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The Packages and Thermal Characteristics chapter of the Data Book is quite large. To make the information more accessible on the Web, this page provides links to the text information only and individual package drawings. Text Information OnlyPackages and Thermal Characteristics - This document contains: |
Plastic DIP | PD8 |
SOIC | SO8, VO8, SO20 |
PLCC | PC20, PC28, PC44, PC68, PC84 |
PQFP |
PQ44, PQ160, PQ208, PQ240, HQ160, HQ208,
HQ240,
PQ100, HQ100, PQ304, HQ304 |
TQFP | TQ100, TQ144, TQ176, HT100, HT144, HT176 |
VQFP | VQ44, VQ64, VQ100 |
Chip Scale | CS48, CS144, CS280 |
BGA | BG225, BG256, BG352, BG432, BG560 |
Ceramic PGA |
PG68, PG84,
PG120, PG132, PG156,
PG175,
PG191,
PG223, PG299, PG411, PG475, PG559 |
Ceramic Brazed QFP | CB100, CB164, CB196 (XC4000), CB228 |
Ball Fine Pitch | FG256, FG456, FG676 FG680 |
Plastic PGA | PP175 |
To request a package drawing for a discontinued product, send a request to datasheet@xilinx.com |