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Packages and Thermal Characteristics 

Text Information
Individual Package Drawings

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The Packages and Thermal Characteristics chapter of the Data Book is quite large. To make the information more accessible on the Web, this page provides links to the text information only and individual package drawings

Text Information Only

pdf Packages and Thermal Characteristics - This document contains: 
  • Package Information
  • Thermal Management
  • Package Thermal Characterization Methods & Conditions
  • Power Management Options
  • Package Electrical Characterization
  • Component Mass by Package Type
  • Xilinx Thermally Enhanced Packaging
  • Moisture Sensitivity
  • Tape and Reel
  • Reflow Soldering Process Guidelines
  • Sockets
  •  Individual Package Drawings

    Plastic DIP pdf PD8
    SOIC pdf SO8, VO8 SO20
    PLCC pdf PC20, PC28, PC44, PC68, PC84
    PQFP pdf PQ44, PQ160, PQ208, PQ240, HQ160, HQ208, HQ240
    pdf PQ100, HQ100pdf PQ304, HQ304
    TQFP pdf TQ100, TQ144, TQ176, HT100, HT144, HT176
    VQFP pdf VQ44, VQ64, VQ100
    Chip Scale CS48 CS144 CS280
    BGA pdf BG225 BG256pdf BG352, BG432 BG560
    Ceramic PGA pdf PG68, PG84pdf PG120, PG132, PG156pdf PG175pdf PG191
    pdf PG223, PG299pdf PG411 PG475, PG559
    Ceramic Brazed QFP pdf CB100, CB164, CB196 (XC4000)pdf CB228
    Ball Fine Pitch FG256 FG456 FG676  FG680 
    Plastic PGA pdf PP175
     
    To request a package drawing for a discontinued product, send a request to datasheet@xilinx.com