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| Number | Description | Effective Date |
| PCN95013 | A minor change in the part marking methodology utilized for Xilinx Products | Dec 26, 1995 |
| PCN95010B | An update to PCN95010A | Jul 1, 1997 |
| PCN95010A | An update to PCN95010 | Jun 28, 1996 |
| PCN95010 | A New Manufacturer for the Xilinx Serial Configuration PROM's & Obsolescence of the Existing PROM Products | Dec 18, 1995 |
| PCN95009 | Qualification of the Advanced Semiconductor Engineering, Inc. (ASE) Assembly Facility to Assemble Plastic Quad Flat Packs (TQ, PQ) for Xilinx Products | Dec 11, 1995 |
| PCN95008 | Qualification of AAPI-1 Assembly Facility to Assemble Plastic Quad Flat Packs (TQ, PQ) for Xilinx Products | Dec 11, 1995 |
| PCN95007 | Qualification of Integrated Packaging Assembly Corporation (IPAC) as a New Assembly Subcontractor | Dec 11, 1995 |
| PCN95006 | A minor change to the electrical specifications of some Xilinx Ceramic Packaged Devices | Aug 22, 1995 |
| PCN95005 | An Evolutionary Change in the Xilinx XC7000 Fabrication Process | Aug 10, 1995 |
| PCN95004 | Qualification of ASTRA Microtronics Technology as a New Assembly Subcontractor | Jun 30, 1995 |
| PCN95003 | Withdrawal of the XC1765DDD8R (Obsolete Device) | Apr 17, 1995 |
| PCN95002B | PCN Update: An Evolutionary Change in the Xilinx Wafer Fabrication Process | Jun 18, 1996 |
| PCN95002A | PCN Update: An Evolutionary Change in the Xilinx Wafer Fabrication Process | Aug 11, 1995 |
| PCN95002 | An Evolutionary Change in the Xilinx XC4000 Fabrication Process | Apr 6, 1995 |
| PCN95001 | Addition of a New Process for the Xilinx XC1718D, XC1736D, and XC1765D Serial Configuration PROMs | Mar 31, 1995 |