Xilinx
has two CSP packages as part of the high performance XC9500XL 3.3V family:
The XC9536XL and XC9572XL are available in the 48 pin CSP (7 x 7 ball array),
and the XC95144XL is available in the 144 pin CSP (12 x 12 ball array).
Both feature a 0.8 millimeter ball pitch.
These CSP packages offer all the benefits of an
extremely small form factor in a rugged ball grid array package.
They are ideally suited for a growing number of space premium applications
where minimum board space and package thickness are important. Applications
include PCMCIA cards, PC add-in cards, and portable and wireless designs.
The XC9536 member of the XC9500 5V family, is also available in the
48 pin CSP.
Both packages are about one third the size of traditional
PLCC packages. With chip scale packages, the requirements for handling
and lead coplanarity are greatly reduced because there are no fragile leads
to bend.
The die is attached to the substrate and wire bonded
using industry-standard techniques. System manufacturers using CSPs
can benefit from board space savings and reduced overall costs. It
is also important to note that there will be no change in package size
and ball pitch with future die shrinks.
These packages are also thin (1.3 to 1.8mm) and
light weight (0.17 gram) which makes it ideally suited for weight conscious
portable applications like cellular phones, hand held inventory, bar code
reader systems and personal digital assistants. |
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