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1997 Product Change Notifications 
 
| Number | 
Description | 
Effective Date | 
 
| PCN97009A | 
A reissue of a minor enhancement to the Xilinx line of thermally enhanced
quad flatpack (HQFP) packages. | 
Oct 29, 1997 | 
 
| PDN97008A | 
An update of PDN97008.  New Last Time Buy and Last Time Delivery
dates. | 
Apr 15, 1998 | 
 
| PDN97008 | 
Discontinuance of the XC7000 Product Families (including XC7200 and
XC7300). | 
Aug 01, 1997 | 
 
| PCN97007 | 
Conversion of Xilinx MIL-STD-883 Military Products to QML. | 
Apr 15, 1997 | 
 
| PDN97006 | 
Withdrawal of certain specific low volume device/package
combinations. Note that no Xilinx military offerings are affected. (See
also XCU019701). | 
Jan 30, 1997 | 
 
| PDN97005 | 
Withdrawal of certain specific low volume device/package combinations.
Note that no Xilinx military offerings are affected. (See also XCU019701). | 
Jan 30, 1997 | 
 
| PDN97004 | 
Withdrawal of Commercial and Industrial XC3100A -5 Speed Grades, all
packages (note: Xilinx Military Products are not affected). (See also XCU019702). | 
Jan 30, 1997 | 
 
| PDN97003 | 
Withdrawal of Commercial and Industrial XC3000 -70 Speed
Grades, all packages (note: Xilinx Military Products are not affected).
(See also XCU019702). | 
Jan 30, 1997 | 
 
| PCN97002 | 
Additional Product Assembly Qualification of A.S.E. Taiwan. | 
Feb 15, 1997 | 
 
| PCN97001 | 
Qualification of ASTRA Microtronics Technology in Batam, Indonesia
as an assembly site for Xilinx PLCC packages. | 
Feb 28, 1997 | 
 
 
 
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