Packages and Thermal Characteristics

Text Information

Individual Package Drawings

to view

PDF files below.

The Packages and Thermal Characteristics chapter of the Data Book is quite large. To make the information more accessible on the Web, this page provides links to the text information only and individual package drawings.

Text Information Only

Packages and Thermal Characteristics - This document contains:

Package Information

Thermal Management

Package Thermal Characterization Methods & Conditions

Some Power Management Options

Package Electrical Characterization

Component Mass (Weight) by Package Type

Xilinx Thermally Enhanced Packaging

Moisture Sensitivity of PSMCs

Tape and Reel

Reflow Soldering Process Guidelines

Sockets

Individual Package Drawings

Plastic DIP Packages -

PD8

SOIC Packages - pdf SO8, VO8, SO20

PLCC Packages - pdf PC20, PC28, PC44, PC68, PC84

PQFP Packages - pdf PQ44, PQ160, PQ208, PQ240, HQ160, HQ208, HQ240, pdf PQ100, HQ100, pdf PQ304, HQ304

TQFP Packages - pdf TQ100, TQ144, TQ176, HT100, HT144, HT176

VQFP Packages - pdf VQ44, VQ64, VQ100

Chip Scale Package - CS48

BGA Packages - pdf BG225, BG256, pdf BG352, BG432, BG560

Ceramic DIP Packages - pdf DD8

Ceramic PGA Packages - pdf PG68, PG84, pdf PG120, PG132, PG156, pdf PG175, pdf PG191, pdf PG223, PG299, pdf PG411, PG475, PG559

Ceramic Brazed QFP Packages - pdf CB100, CB164, CB196 (XC4000), pdf CB100 (XC3000), pdf CB164 (XC3000), pdf CB228

Plastic PGA Packages - pdf PP175

To request a package drawing for a discontinued product, send a request to datasheet@xilinx.com