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2000 Product Change Notifications
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| PCN2000-08 |
Additional equivalent wafer foundries for fabrication of Virtex commercial
(C-grade and I-grade) product family. |
December 29, 2000 |
| PDN2000-07 |
Discontinuation of certain XPLA CPLD Families. |
October 19, 2000 |
| PCN2000-06 |
Minor modification in the package outline specification for thermally
enhanced BG and FG series packages meeting the JEDEC-MO-191. |
October 5, 2000 |
| PDN2000-05 |
Discontinuation of Certain Hardwire 1 Products (1.0µm and 1.5µm) |
September 28, 2000 |
| PCN00003 |
A change in the die-attach material for all thermally enhanced SBGA
or VBGA. |
August 3, 2000 |
| PCN00002A |
Update some of the assembly locations listed in PCN00002. |
March 20, 2000 |
| PCN00002 |
A change in the assembly and test flows used to manufacture the Xilinx
CoolRunner (C-grade and I-grade) product families. |
January 30, 2000 |
| PDN00001 |
Withdrawal of certain commercial low volume device/package combinations.
All speed grades and all temperature grades are affected. Note, however,
that no Xilinx Military product offerings are affected |
January 15, 2000 |
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