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1996 Product Change Notifications
| Number |
Description |
Effective Date |
| PCN96011 |
An Evolutionary Change in the Xilinx XC5200 Fabrication Process |
Dec 20, 1996 |
| PCN96010 |
Discontinuance of the XC2000 Product Families (all speed
grades and package options including B-Grade and SMD [Standard Military
Drawing] Devices) |
Dec 20, 1996 |
| PCN96009 |
Discontinuation of the XC4000A and XC4000H Product Families |
Oct 01, 1996 |
| PCN96008 |
An Evolutionary Change in the Xilinx XC4000/D Fabrication |
Oct 01, 1996 |
| PCN96007 |
Discontinuance of the XC8100 Antifuse Product Line |
Aug 09, f996 |
| PCN96006 |
XC73144 PQ160: Cin Parameter Change |
Jul 16, 1996 |
| PCN96005 |
Qualification of A.S.E. Taiwan as a New Assembly Subcontractor |
Jun 28, 1996 |
| PCN96004 |
A New Wafer Foundry Partner United Microelectronics Corporation (UMC),
for Xilinx Programmable Logic Products |
May 15, 1996 |
| PCN96003 |
Obsolescence of Commercial and Military CQFP-100 ceramic packages |
May 03, 1996 |
| PCN96002A |
Product Availability Extension of XC7300 CPLD family at the tsmc Manufacturing
Facility |
Jul 03, 1996 |
| PCN96002 |
Qualification of Seiko Epson as a Manufacturing Facility for the XC7300
Product family |
Apr 02, 1996 |
| PCN96001 |
A Change in the Xilinx XC3100 Fabrication Process |
Apr 19, 1996 |
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