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1999 Product Change Notifications
| Number |
Description |
Effective Date |
| PCN99008 |
A change to the Icc Standby Specification of XC1702L and XC1704L Products
(all Packages) |
October 1, 1999 |
| PDN99007A |
Addendum to PDN99007 to pull in the Last
Time Buy and Last Time Ship dates for certain parts that use the PP132
and PP175 packages. |
January 30, 2000 |
| PDN99007 |
Withdrawal of certain commercial low volume device/package combinations.
All speed grades and all temperature grades are affected. Note, however,
that no Xilinx Military product offerings are affected. |
October 15, 1999 |
| PDN99005 |
Discontinuance of Certain Technology (0.8uM 10% shrink CMOS) Versions
of the XC3000, XC3000A and XC3100A Product Families. |
July 15, 1999 |
| PDN99004 |
Discontinuance of Die and Wafer Sales for all Xilinx Product Families. |
July 1, 1999 |
| PDN99003 |
Discontinuation of certain members of the XC4000 Commercial and Industrial
Product Line. |
April 19, 1999 |
| PCN99002 |
A change in the wafer fabrication process used to fabricate the XC4000XL
commercial (C-grade and I-grade) product family. Note that this notice
does not affect any SMD (Standard Military Drawing) devices. |
May 24, 1999 |
| PDN99001 |
Discontinuation of certain speed grades of the XC3000 and XC4000 SMD
(Standard Military Drawing) and Commercial (M-grade) Products. |
January 15, 1999 |
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