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| October 29, 1997
Attention Valued Customer: Subject: Product Change Notice (PCN97009A) A reissue of a minor enhancement to the Xilinx line of thermally enhanced quad flatpack (HQFP) packages. Products Affected: All Xilinx Product packaged
in the HQ208 and HQ240 Package, including specifically:
Change Description: Xilinx is replacing the electrically conductive heat sink used for some of our products (package types HQ208 and HQ240) with an electrically insulated heat sink. Reason For Change: This minor change will provide complete electrical insulation of the heat sink on the bottom of the package. The change is being made to the HQ208 and HQ240 only, as these packages have their heat sinks facing down. The current HQ304 is a heat sink up package, and does not need this enhancement. Qualification data for these packages is attached. Key Dates: Xilinx has evaluation quantities of this package available today. Standard production utilizing the enhanced package configuration will start October 15, 1997 with conversion of all product lines expected to be complete by July, 1998. After July, 1998 Xilinx will make the older non-insulated packages available under SCD0509 if customers require additional time to complete qualification testing. The last time buy (LTB) for the older package under the SCD0509 will be December, 1998 with last time ship (LTS) in March, 1999. Traceability: All product assembled with a date code after July, 1998 will be of the new construction, unless ordered specifically under SCD. However, both products are form, fit and functionally equivalent, with similar thermal dissipation capabilities (see attached thermal coefficient data). Device marking will not change. Products will continue to be assembled by our qualified assembly partners in Korea (ANAM) and Japan (SEIKO). Immediate response to this notification is not required. For any questions regarding this PCN you may contact Xilinx via email at "pcn@xilinx.com" or by FAX at 408- 559-1368. Joseph J. Fabula
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